416 Other Function uPs,uCs & Peripheral ICs 9

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX508CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ	40	260	13 mm	CMOS	1.225 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1
FLI30336-AC	STMicroelectronics	MICROPROCESSOR CIRCUIT		BALL	416	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		GRID ARRAY					TIN SILVER COPPER	BOTTOM				30	250		CMOS			X-PBGA-B416	3		e1
MCIMX507CVK1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel		BOTTOM	1.52 mm	13 mm				13 mm	CMOS	1.225 V	.5 mm	S-PBGA-B416		Not Qualified
MCIMX508CVK1B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.225 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX507CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX508CVK8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX507CVK8BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1
MCIMX508CZK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel		BOTTOM	.9 mm	13 mm				13 mm	CMOS	1.225 V	.5 mm	S-PBGA-B416
MCIMX502CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	13 mm		40	260	13 mm	CMOS	1.05 V	.5 mm	S-PBGA-B416	3	Not Qualified	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.