Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3.3 V |
.4 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cml Microcircuits |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
6 mm |
6 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
30 |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.3,20 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.1 mm |
6.1 mm |
30 |
260 |
12.5 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
.5 mm |
R-PDSO-G48 |
2 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
2 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
0 |
20 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
7 mm |
20 |
260 |
7 mm |
65536 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
2 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
0 |
20 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
2 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
0 |
20 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
2 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
0 |
20 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
2 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
0 |
20 MHz |
30 |
260 |
7 mm |
2048 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER |
1.71 V |
105 Cel |
-40 Cel |
NICKEL GOLD |
QUAD |
40 |
260 |
CMOS |
3.3 V |
S-XQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
QUAD |
1 mm |
7 mm |
7 mm |
CMOS |
.5 mm |
S-PQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER |
1.71 V |
105 Cel |
-40 Cel |
NICKEL GOLD |
QUAD |
40 |
260 |
CMOS |
3.3 V |
S-XQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
32768 |
6 mm |
30 |
260 |
6 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.4 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
|||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.18 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7 mm |
40 |
260 |
7 mm |
CMOS |
1.25 V |
.5 mm |
S-PQCC-N48 |
2 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.18 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.25 V |
.5 mm |
S-PQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Atmel |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP48,.35SQ,20 |
85 Cel |
-40 Cel |
QUAD |
40 mA |
5 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.6 mm |
16384 |
6 mm |
30 |
260 |
6 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.4 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3.3 V |
.4 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
SQUARE |
YES |
5.5 V |
1.71 V |
QUAD |
IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY |
CMOS |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.62 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7 mm |
40 |
260 |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
2 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.62 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.18 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.25 V |
.5 mm |
S-PQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.