Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
45 V |
CHIP CARRIER, HEAT SINK/SLUG |
6.7 V |
125 Cel |
-40 Cel |
QUAD |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
8 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
48 |
HQCCN |
SQUARE |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC48,.27SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.21 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
30 |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
45 V |
CHIP CARRIER, HEAT SINK/SLUG |
6.7 V |
125 Cel |
-40 Cel |
QUAD |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
8 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF |
30 |
260 |
7 mm |
CMOS |
3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF |
30 |
260 |
7 mm |
81920 |
CMOS |
3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
30 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
45 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
125 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.3 V |
TS 16949 |
1.2,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.1 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1 mm |
7 mm |
0 |
24 MHz |
7 mm |
CMOS |
60 mA |
1.2 V |
Bus Controllers |
.5 mm |
S-PQCC-N48 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G48 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
45 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8 V |
125 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF |
30 |
260 |
7 mm |
81920 |
CMOS |
3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
30 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
325 mA |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
325 mA |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER |
1.71 V |
105 Cel |
-40 Cel |
NICKEL GOLD |
QUAD |
40 |
260 |
CMOS |
3.3 V |
S-XQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
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|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
4 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
20 MHz |
30 |
260 |
7 mm |
4096 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
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|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.3,20 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.2 mm |
6.1 mm |
30 |
260 |
12.5 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
.5 mm |
R-PDSO-G48 |
2 |
Not Qualified |
e3 |
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|
Infineon Technologies |
PSoC |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G48 |
3 |
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|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER |
1.71 V |
105 Cel |
-40 Cel |
NICKEL GOLD |
QUAD |
40 |
260 |
CMOS |
3.3 V |
S-XQCC-N48 |
3 |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
QUAD |
1 mm |
7 mm |
7 mm |
CMOS |
.5 mm |
S-PQCC-N48 |
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|
Infineon Technologies |
PSoC |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
7 mm |
260 |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G48 |
3 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
16 |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.4 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
4 |
7 mm |
IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY |
TIMER |
20 MHz |
30 |
260 |
7 mm |
4096 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART; USB |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
20 rpm |
e4 |
30 |
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C-media Electronics |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP48,.35SQ,20 |
70 Cel |
-15 Cel |
QUAD |
5 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
Not Qualified |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.