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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | CC1312R1F3RGZR |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; |
Datasheet | CC1312R1F3RGZR Datasheet |
In Stock | 8,639 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1 mm |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 48 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 30 |
Technology: | CMOS |
JESD-30 Code: | S-PQCC-N48 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Width: | 7 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 3.8 V |
RAM Bytes: | 81920 |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
Length: | 7 mm |
Additional Features: | DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |