NXP Semiconductors - MCIMX535DVV1CR2

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MCIMX535DVV1CR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX535DVV1CR2
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
In Stock578
NAME DESCRIPTION
Minimum Supply Voltage: 1.2 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.25 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.85 mm
Sub-Category: Graphics Processors
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 529
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B529
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: HBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.4 V
JESD-609 Code: e2
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA529,23X23,32
Length: 19 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Power Supplies (V): 0.9/1.25,1.3
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