Texas Instruments - MSP430F6779IPEU

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MSP430F6779IPEU by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number MSP430F6779IPEU
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;
Datasheet MSP430F6779IPEU Datasheet
In Stock2,595
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.6 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 11.75 mA
Terminal Finish: NICKEL PALLADIUM GOLD
ADC Channels: YES
No. of Terminals: 128
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Technology: CMOS
RAM Words: 32
JESD-30 Code: R-PQFP-G128
Maximum Clock Frequency: 25 MHz
Package Shape: RECTANGULAR
ROM Words: 524288
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Speed: 25 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
RAM Bytes: 32768
External Data Bus Width: 0
Bit Size: 16
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP128,.63X.87,20
Length: 20 mm
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Bus Compatibility: I2C; SPI; UART
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2/3.3
CPU Family: MSP430
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