49 Other Function uPs,uCs & Peripheral ICs 34

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
PN7120A0EV/C10801Y	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM							30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PBGA-B49	3	Not Qualified	e1
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM							30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm	S-PBGA-B49	3	Not Qualified	e1
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY		1.71 V				BOTTOM				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS						R-PBGA-B49
LM8333GGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V		2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm				30	260	4 mm	CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm	S-PBGA-B49	1	Not Qualified
LM8333GGR8X	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V			GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm						4 mm	CMOS					.5 mm	S-PBGA-B49		Not Qualified
SCANSTA101SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM		1.5 mm	7 mm				20	235	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	3	Not Qualified	e0
SCANSTA111SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.5 mm	7 mm				30	260	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	4	Not Qualified	e1
SCANSTA101SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM		1.5 mm	7 mm				20	235	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	3	Not Qualified	e0
LM8333GGR8AXSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V	1	2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4	1.1 mm	4 mm				30	260	4 mm	CMOS	80 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B49	1	Not Qualified	e1	4
LM8333GGR8/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V		2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm				30	260	4 mm	CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm	S-PBGA-B49	1	Not Qualified
LM8333GGR8AXS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V	1	2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.1 mm	4 mm		0	.4 MHz	30	260	4 mm	CMOS	6 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B49	1	Not Qualified	e1	4
LM8333GGR8	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V			GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm						4 mm	CMOS					.5 mm	S-PBGA-B49		Not Qualified
SCANSTA111SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM		1.5 mm	7 mm				20	235	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	3	Not Qualified	e0
LM8333	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	UNSPECIFIED	YES	2.75 V			GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel	TIN	BOTTOM		1.1 mm	4 mm						4 mm	CMOS					.5 mm	S-XBGA-B49	1	Not Qualified	e3
SCANSTA111SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM		1.5 mm	7 mm				20	235	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	3	Not Qualified	e0
SCANSTA101SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.5 mm	7 mm		32		30	260	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	4	Not Qualified	e1
SCANSTA101SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.5 mm	7 mm		32		30	260	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	4	Not Qualified	e1
SCANSTA111SMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.5 mm	7 mm				30	260	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm	S-PBGA-B49	4	Not Qualified	e1
LC898113	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM		.8 mm	4 mm						4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49
LC898113RA-WH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM		.8 mm	4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM					4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49
LC898113-TBM-H	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM		.8 mm	4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM			30	260	4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49	4
PN5472A2EV/C20804	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM		1 mm	4 mm						4.3 mm	CMOS		3.6 V			.5 mm	R-PBGA-B49
PN5472A2EV/C20803	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM		1 mm	4 mm						4.3 mm	CMOS		3.6 V			.5 mm	R-PBGA-B49
CY8CTMA400-49FNIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		BALL	49		SQUARE		YES	5.5 V					1.71 V				BOTTOM				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS						S-XBGA-B49
CY8C6145FNI-S3F71	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
CY8CTMA468-49FNIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		BALL	49		SQUARE		YES	5.5 V					1.71 V				BOTTOM				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS						S-XBGA-B49
CYW20707UA1KFFB1G	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,6X8,20	1.14 V	85 Cel	-30 Cel		BOTTOM		1 mm	4 mm						4.5 mm	CMOS		1.2 V			.5 mm	R-PBGA-B49
CY8CTMA467-49FNIT	Infineon Technologies	MICROPROCESSOR CIRCUIT		BALL	49		SQUARE		YES	5.5 V					1.71 V				BOTTOM				IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY						CMOS						S-XBGA-B49
CY8C6145FNI-S3F11	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
CY8C6145FNI-S3F41	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
CY8C6245FNI-S3D41	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
CY8C6245FNI-S3D71	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
CY8C6245FNI-S3D11	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM		.467 mm	2.8819 mm						3.1024 mm	CMOS		1.8 V			.42 mm	R-PBGA-B49
TC358764XBG	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.1 V	85 Cel	-30 Cel		BOTTOM		1.2 mm	5 mm						5 mm	CMOS		1.2 V			.65 mm	S-PBGA-B49

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.