HTFQFP Other Function uPs,uCs & Peripheral ICs 14

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XUF216-512-TQ128-C20A

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

XVF3000-TQ128-CA

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

XUF216-512-TQ128-I20A

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

85 Cel

-40 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

SN75LVDS88PFD

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

Not Qualified

TVP9900PFP

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.65 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.35 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1.2 mm

12 mm

30

260

12 mm

CMOS

1.5 V

.5 mm

S-PQFP-G80

4

Not Qualified

e4

SN75LVDS88APFD

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

Not Qualified

SN75LVDS88APFDR

Texas Instruments

MICROPROCESSOR CIRCUIT

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

QUAD

1.2 mm

14 mm

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

Not Qualified

SN75LVDS88BPFD

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

.5 mm

S-PQFP-G100

Not Qualified

TSB12LV22PZP

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

100

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3,3.3/5

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

QFP100,.63SQ,20

3 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3.3 V

Bus Controllers

.5 mm

S-PQFP-G100

Not Qualified

TVP9900PFPR

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.65 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

1.35 V

70 Cel

0 Cel

QUAD

1.2 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

12 mm

CMOS

1.5 V

.5 mm

S-PQFP-G80

Not Qualified

STCOMET05

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

176

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

QUAD

1.2 mm

20 mm

NOT SPECIFIED

NOT SPECIFIED

20 mm

CMOS

1.2 V

.4 mm

S-PQFP-G176

STCOMET10

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

176

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

QUAD

1.2 mm

20 mm

NOT SPECIFIED

NOT SPECIFIED

20 mm

CMOS

1.2 V

.4 mm

S-PQFP-G176

STCOM10

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

176

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

QUAD

1.2 mm

20 mm

NOT SPECIFIED

NOT SPECIFIED

20 mm

CMOS

1.2 V

.4 mm

S-PQFP-G176

STCOM05

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

176

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

QUAD

1.2 mm

20 mm

NOT SPECIFIED

NOT SPECIFIED

20 mm

CMOS

1.2 V

.4 mm

S-PQFP-G176

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.