Texas Instruments - TSB12LV22PZP

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TSB12LV22PZP by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TSB12LV22PZP
Description MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HTFQFP; Package Shape: SQUARE;
Datasheet TSB12LV22PZP Datasheet
In Stock956
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Sub-Category: Bus Controllers
Surface Mount: YES
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: HTFQFP
Width: 14 mm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.63SQ,20
Length: 14 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3,3.3/5
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