Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
5 mm |
40 |
260 |
7 mm |
CMOS |
3.3 V |
.5 mm |
R-XQCC-N38 |
3 |
e3 |
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|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N56 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.71 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
e4 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
18 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.24SQ,20 |
3.6 V |
115 Cel |
-40 Cel |
QUAD |
1 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
SPI |
.5 mm |
S-XQCC-N32 |
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Qualcomm |
MICROPROCESSOR CIRCUIT |
NO LEAD |
148 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.14 V |
BOTTOM |
.9 mm |
12 mm |
12 mm |
CMOS |
1.2 V |
.5 mm |
S-PBCC-N148 |
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|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
0 |
NO |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
70 Cel |
0 Cel |
MATTE TIN |
NO |
QUAD |
NO |
.9 mm |
6 mm |
0 |
6 mm |
CMOS |
3.3 V |
NO |
EEPROM |
.5 mm |
S-XQCC-N40 |
e3 |
0 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAPACITIVE TOUCH SCREEN CONTROLLERS |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2SQ,16 |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
5 mm |
5 mm |
CMOS |
1.1 V |
.4 mm |
S-XQCC-N40 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PSoC |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.27SQ,20 |
1.71 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.71 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PROGRAMMABLE SoC |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
AEC-Q100 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.8 V |
105 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
6 mm |
6 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N40 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
SoC |
OTHER |
NO LEAD |
72 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-10 Cel |
MATTE TIN |
QUAD |
.9 mm |
10 mm |
30 |
260 |
10 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N72 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.62 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
8 mm |
8 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N68 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.8 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SYSTEM ON CHIP |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
1.62 V |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7 mm |
40 |
260 |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
2 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.85 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.35SQ,20 |
2 V |
85 Cel |
MSP430 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
32768 |
9 mm |
0 |
30 |
260 |
9 mm |
4096 |
CMOS |
5.1 mA |
3 V |
Microcontrollers |
FLASH |
I2C; SPI; UART |
.5 mm |
S-PQCC-N64 |
3 |
Not Qualified |
20 rpm |
e4 |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
YES |
QUAD |
1 mm |
6 mm |
30 |
260 |
6 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N40 |
2 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CLOCK GENERATOR, OTHER |
NO LEAD |
64 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
BGA64,8X8,32 |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
1 mm |
5 mm |
10 mm |
CMOS |
1.8 V |
.4 mm |
R-XQCC-N64 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
0 |
30 |
260 |
7 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; UART; USART |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
0 |
30 |
260 |
5 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; UART; USART |
.5 mm |
S-PQCC-N32 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.65 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.45 V |
70 Cel |
0 Cel |
QUAD |
1 mm |
4 mm |
4 mm |
CMOS |
1.5 V |
.5 mm |
S-PQCC-N24 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
0 |
30 |
260 |
6 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; UART |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
COMPARATORS, TIMER(4) |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
21 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
COMPARATORS, TIMER(4) |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
21 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
0 |
30 |
260 |
6 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; UART |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
0 |
30 |
260 |
6 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; UART |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.9 mm |
5 mm |
30 |
260 |
5 mm |
CMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
2 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
7 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQCC-N48 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.9 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
QUAD |
.8 mm |
6 mm |
0 |
2 MHz |
30 |
260 |
6 mm |
CMOS |
3.3 V |
I2C; UART |
.5 mm |
S-PQCC-N40 |
2 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 V |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
e4 |
21 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
COMPARATORS, TIMER(4) |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
21 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
QUAD |
.8 mm |
6 mm |
0 |
2 MHz |
30 |
260 |
6 mm |
CMOS |
3.3 V |
I2C; UART |
.5 mm |
S-PQCC-N40 |
2 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.9 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
e4 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.