TFBGA Other Function uPs,uCs & Peripheral ICs 61

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel	-20 Cel		BOTTOM		1.1 mm	12 mm				40	260	12 mm		CMOS		1.225 V			.4 mm	S-PBGA-B488	3
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM		1.01 mm	11 mm				40	260	11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306	3
MCIMX6L8DVN10AA	NXP Semiconductors	SoC		BALL	432	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.1 mm	13 mm				40	260	13 mm		CMOS					.5 mm	S-PBGA-B432	3		e1
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel	0 Cel		BOTTOM		1.1 mm	12 mm				40	260	12 mm		CMOS		1.1 V			.4 mm	S-PBGA-B488	3
A2F200M3F-CSG288I	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA288,21X21,20	1.425 V	100 Cel	-40 Cel		BOTTOM		1.05 mm	11 mm						11 mm		CMOS		1.5 V			.5 mm	S-PBGA-B288	3
MIMX8MN1DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM		1.01 mm	11 mm				40	260	11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306	3
MCIMX7D3DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel	0 Cel		BOTTOM		1.1 mm	12 mm				40	260	12 mm		CMOS		1.225 V			.4 mm	S-PBGA-B488	3
STV0991FAH	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FAH/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM		1.01 mm	11 mm				40	260	11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306	3
MTFC8GLCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel		BOTTOM		1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY			30	260	13 mm		CMOS		1.8 V			.5 mm	R-PBGA-B153
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM											CMOS		1.5 V				S-PBGA-B288	3
X1642BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel		BOTTOM		1.17 mm	10.4 mm						10.4 mm		CMOS		1.2 V			.65 mm	S-PBGA-B161
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		1.17 mm	10.4 mm				NOT SPECIFIED	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.2 mm	10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.17 mm	10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
AWR1642ABIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm	S-PBGA-B161	3		e1
X1443BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel		BOTTOM		1.17 mm	10.4 mm						10.4 mm		CMOS		1.2 V			.65 mm	S-PBGA-B161
LM8333GGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V			2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm				30	260	4 mm		CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm	S-PBGA-B49	1	Not Qualified
LM8333GGR8X	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V				GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm						4 mm		CMOS					.5 mm	S-PBGA-B49		Not Qualified
LM8333GGR8AXSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V		1	2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4	1.1 mm	4 mm				30	260	4 mm		CMOS	80 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B49	1	Not Qualified	e1	4
LM8322JGR8/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN	BOTTOM		1.1 mm	3.5 mm						3.5 mm		CMOS		1.8 V			.5 mm	S-PBGA-B36	1	Not Qualified	e3
LM8322JGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN	BOTTOM		1.1 mm	3.5 mm						3.5 mm		CMOS		1.8 V			.5 mm	S-PBGA-B36	1	Not Qualified	e3
LM8333GGR8/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V			2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm				30	260	4 mm		CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm	S-PBGA-B49	1	Not Qualified
LM8333GGR8AXS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V		1	2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.1 mm	4 mm		0	.4 MHz	30	260	4 mm		CMOS	6 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B49	1	Not Qualified	e1	4
LM8322JGR8	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	3.5 mm						3.5 mm		CMOS		1.8 V			.5 mm	S-PBGA-B36		Not Qualified
LM8333GGR8	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V				GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm						4 mm		CMOS					.5 mm	S-PBGA-B49		Not Qualified
LM8333	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	UNSPECIFIED	YES	2.75 V				GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel	TIN	BOTTOM		1.1 mm	4 mm						4 mm		CMOS					.5 mm	S-XBGA-B49	1	Not Qualified	e3
LM8322JGR8X	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	3.5 mm						3.5 mm		CMOS		1.8 V			.5 mm	S-PBGA-B36		Not Qualified
LM8323JGR8AXM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V			1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.1 mm	3.5 mm		0		30	260	3.5 mm		CMOS	3 mA	1.9 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B36	1	Not Qualified	e1
LM8323JGR8AXMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V			1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA36,6X6,20	1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.1 mm	3.5 mm		0		30	260	3.5 mm		CMOS	3 mA	1.9 V	Other Microprocessor ICs	I2C	.5 mm	S-PBGA-B36	1	Not Qualified	e1
STV0991NA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991NA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FN/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991NAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FAR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991NAR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991FN	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991NN	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
STV0991NN/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM		1.12 mm	10 mm						10 mm		CMOS		1.1 V			.65 mm	S-PBGA-B201
SDIO101IET	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel		BOTTOM		1.1 mm	4 mm						4 mm		CMOS		1.8 V			.4 mm	S-PBGA-B64		Not Qualified
MIMX8MN5DVPIZDA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM		1.01 mm	11 mm						11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306
MIMX8MN5DVPIZCA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM		1.01 mm	11 mm						11 mm		CMOS		.95 V			.5 mm	S-PBGA-B306

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.