Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Nordic Semiconductor Asa |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
94 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC94,.27SQ,16 |
1.7 V |
105 Cel |
-40 Cel |
QUAD |
.85 mm |
7 mm |
7 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N94 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
94 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC94,.27SQ,16 |
1.7 V |
105 Cel |
-40 Cel |
QUAD |
.85 mm |
7 mm |
7 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N94 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
CRYPTOGRAPHIC AUTHENTICATOR |
BALL |
95 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA95,12X12,14 |
1.7 V |
105 Cel |
-40 Cel |
BOTTOM |
.447 mm |
3.994 mm |
4.39 mm |
CMOS |
3 V |
.35 mm |
R-PBGA-B95 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
CRYPTOGRAPHIC AUTHENTICATOR |
BALL |
95 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA95,12X12,14 |
1.7 V |
105 Cel |
-40 Cel |
BOTTOM |
.447 mm |
3.994 mm |
4.39 mm |
CMOS |
3 V |
.35 mm |
R-PBGA-B95 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
260 |
3 mm |
CMOS |
I2C |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
30 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
I2C |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
260 |
3 mm |
CMOS |
I2C |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 mm |
5 mm |
260 |
6 mm |
CMOS |
1.27 mm |
R-XDSO-N8 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1.27 mm |
R-PDSO-G8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
QUAD |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
105 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
DUAL |
.6 mm |
2 mm |
3 mm |
CMOS |
1-WIRE |
.5 mm |
R-PDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1-WIRE |
1.27 mm |
R-PDSO-G8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
30 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
85 Cel |
-40 Cel |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
1-WIRE |
1.27 mm |
R-PDSO-G8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
40 |
260 |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.12,20 |
1.62 V |
85 Cel |
-25 Cel |
DUAL |
.6 mm |
3 mm |
3 mm |
CMOS |
3.3 V |
.5 mm |
S-PDSO-N10 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
40 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP8,.23 |
2 V |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
I2C |
1.27 mm |
R-PDSO-G8 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
40 |
260 |
3 mm |
CMOS |
3.3 V |
.5 mm |
R-PQCC-N8 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
DUAL |
.6 mm |
2 mm |
3 mm |
CMOS |
1-WIRE |
.5 mm |
R-PDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
3 |
VBCC |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, VERY THIN PROFILE |
2 V |
85 Cel |
-40 Cel |
BOTTOM |
.55 mm |
2.5 mm |
6.5 mm |
CMOS |
1-WIRE |
2 mm |
R-XBCC-N3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
RECTANGULAR |
UNSPECIFIED |
YES |
UNCASED CHIP |
DIE OR CHIP |
105 Cel |
-40 Cel |
UNSPECIFIED |
CMOS |
R-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
85 Cel |
-20 Cel |
TIN |
DUAL |
1.1 mm |
4.4 mm |
9.7 mm |
CMOS |
3.3 V |
.65 mm |
R-PDSO-G28 |
3 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
105 Cel |
-40 Cel |
DUAL |
1 mm |
5 mm |
6 mm |
CMOS |
1.27 mm |
R-XDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE |
SOP8,.25 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.75 mm |
3.9 mm |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
105 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TO-236 |
2 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.12 mm |
1.3 mm |
40 |
260 |
2.9 mm |
CMOS |
3.3 V |
.95 mm |
R-PDSO-G3 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
DUAL |
.6 mm |
2 mm |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
105 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
40 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
DUAL |
.6 mm |
2 mm |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
30 |
260 |
3 mm |
CMOS |
3.3 V |
.5 mm |
R-PQCC-N8 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
105 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 3.3V NOMINAL VOLATGE |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
QUAD |
.33 mm |
3 mm |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-XQCC-N20 |
1 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.