CRYPTOGRAPHIC AUTHENTICATOR Other Function uPs,uCs & Peripheral ICs 447

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	PWM Channels	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code	No. of I/O Lines
ATAES132A-SHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm					260	4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8	1
ATECC108A-SSHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3	e4
ATECC608A-TFLXTLSS	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm	3.9 mm						4.9 mm	CMOS					1.27 mm	R-PDSO-G8		e4
ATECC608B-MAVDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	100 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm	2 mm				30	260	3 mm	CMOS				I2C	.5 mm	R-PDSO-N8	1	e4
ATECC608B-TFLXTLSS-PROTO	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm	3.9 mm		0	1 MHz			4.9 mm	CMOS					1.27 mm	R-PDSO-G8		e4
ATECC608B-TFLXTLSU	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm	2 mm		0	1 MHz			3 mm	CMOS					.5 mm	R-PDSO-N8		e4
DS28C40G/V+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS	3.3 V				.5 mm	R-PDSO-N10	1	e3
SE051A2HQ1/Z01XEZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	105 Cel	-40 Cel			QUAD		.33 mm	3 mm					260	3 mm	CMOS	1.8 V				.4 mm	S-XQCC-N20	1
ST33GTPMA020FAE6	STMicroelectronics	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel	-40 Cel			DUAL		1.2 mm	4.4 mm	also operates with 3.3v and 5v nominal					6.5 mm	CMOS	1.8 V				.65 mm	R-PDSO-G20	1
ATAES132A-MAHER-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm	2 mm				40	260	3 mm	CMOS	3.3 V				.5 mm	R-PDSO-N8	1
ATECC508A-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	5.5 V	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.6 mm	2 mm				40	260	3 mm	CMOS					.5 mm	R-PDSO-N8	1
ATECC508A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3
SLB9665VQ20FW563XUMA3	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	-20 Cel	NICKEL GOLD PALLADIUM SILVER		QUAD		.9 mm	5 mm						5 mm	CMOS	3.3 V				.5 mm	S-PQCC-N32	3
DS28E10R+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL							30	260		CMOS	3.3 V					R-PDSO-G3	1	e3
DS28E50Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
CYPM1211-40LQXI	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2.7 V	105 Cel	-40 Cel			QUAD		.6 mm	6 mm						6 mm	CMOS	3.3 V				.5 mm	S-XQCC-N40	3
AT97SC3204-X2MA-20	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES			0	NO	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		70 Cel	0 Cel	MATTE TIN	NO	QUAD	NO	.9 mm	6 mm		0				6 mm	CMOS	3.3 V	NO	EEPROM		.5 mm	S-XQCC-N40		e3	0
ATECC108A-SSHDA-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE	SOP8,.23	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm				40	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	3	e4
ATECC608A-TNGTLSU-G	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		.6 mm	2 mm						3 mm	CMOS				I2C	.5 mm	R-PDSO-N8		e4
ATSHA204A-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP8,.25	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm	3.9 mm						4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8
MAX66240ESA+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP8,.25		85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		1.75 mm	3.9 mm				30	260	4.9 mm	CMOS					1.27 mm	R-PDSO-G8	1	e3
MAX66250ESA+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR
MAX66242E/W+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	3.63 V					UNCASED CHIP		2.97 V	85 Cel	-40 Cel			UPPER										CMOS	3.3 V					X-XUUC-N
MAX66240ITB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel	-40 Cel			DUAL		.8 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm	CMOS					.5 mm	R-PDSO-N10
MAX66242ETB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS	3.3 V				.5 mm	R-PDSO-N10	1	e4
MAX66240ETB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS					.5 mm	R-PDSO-N10	1	e4
MAX66240ETB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS					.5 mm	R-PDSO-N10	1	e4
MAX66250ESA+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR
MAX66301ETN+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR
MAX66240ITB+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20		85 Cel	-40 Cel			DUAL		.8 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm	CMOS					.5 mm	R-PDSO-N10
MAX66242ESA+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE	SOP8,.25	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		1.75 mm	3.9 mm				30	260	4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8	1	e3
MAX66240E/W+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES						UNCASED CHIP			85 Cel	-40 Cel			UPPER							NOT SPECIFIED	NOT SPECIFIED		CMOS						X-XUUC-N
MAX66242ETB+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS	3.3 V				.5 mm	R-PDSO-N10	1	e4
MAX66242ESA+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE	SOP8,.25	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		1.75 mm	3.9 mm				30	260	4.9 mm	CMOS	3.3 V				1.27 mm	R-PDSO-G8	1	e3
DS2476Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS2476Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS2477Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS2476BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS28C36BQ+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.2 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS28E10P+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL							30	260		CMOS	3.3 V					R-PDSO-C6	1	e3
DS28C40G/V+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V	AEC-Q100				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.16,20	2.97 V	125 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	4 mm	CMOS	3.3 V				.5 mm	R-PDSO-N10	1	e3
DS28E10P+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		C BEND	6		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							2.8 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL							30	260		CMOS	3.3 V					R-PDSO-C6	1	e3
DS28C22Q+U	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	2 mm				30	260	3 mm	CMOS	3.3 V				.5 mm	R-PDSO-N8	1	e3
DS28E10R+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	3		RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							2.8 V	85 Cel	-40 Cel			DUAL							30	260		CMOS	3.3 V					R-PDSO-G3
DS28C36Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	PLASTIC/EPOXY	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-PDSO-N6	1	e3
DS28E38Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,37	2.97 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-XDSO-N6	1	e3
DS28E84Q+T	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	COMMERCIAL	NO LEAD	6	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.12,38	2.97 V	50 Cel	0 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.95 mm	S-XDSO-N6	1	e3
DS28S60Q+	Analog Devices	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	UNSPECIFIED	YES	3.63 V					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC12,.12,20	1.62 V	105 Cel	-40 Cel	Matte Tin (Sn) - annealed		DUAL		.8 mm	3 mm				30	260	3 mm	CMOS	3.3 V				.5 mm	S-XDSO-N12	1	e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.