MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TCI6630K2LDCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6630K2LDCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

MSP430F6765IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

131072

16

14 mm

0

25 MHz

30

260

20 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

TMS320F28PLC83PNTR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

FLATPACK, LOW PROFILE, FINE PITCH

2.97 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

30

260

12 mm

CMOS

3.3 V

.5 mm

S-PQFP-G80

3

e4

SCANSTA101SM

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

3 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.5 mm

7 mm

20

235

7 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B49

3

Not Qualified

e0

MSP430F6746IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

16

14 mm

0

25 MHz

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

TMS320DM369ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

32

30

260

13 mm

CMOS

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

DM355SZCEA135

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

MSP430F6768IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

16

14 mm

0

25 MHz

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6767AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6778IPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

524288

14 mm

0

25 MHz

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F6746AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F67461AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

TCI6636K2HADAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HCXAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

MSP430F67771AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

TCI6636K2HDDAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM335ZCEA135

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.235 V

100 Cel

-40 Cel

BOTTOM

1.3 mm

13 mm

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B337

Not Qualified

LM8333GGR8AXSX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

TFBGA

SQUARE

PLASTIC/EPOXY

YES

2.9 V

1

2.5

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA49,7X7,20

2.25 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4

1.1 mm

4 mm

30

260

4 mm

CMOS

80 mA

2.75 V

Other Microprocessor ICs

I2C

.5 mm

S-PBGA-B49

1

Not Qualified

e1

4

LM8322JGR8/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1.98 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.62 V

85 Cel

-40 Cel

TIN

BOTTOM

1.1 mm

3.5 mm

3.5 mm

CMOS

1.8 V

.5 mm

S-PBGA-B36

1

Not Qualified

e3

TMS320DM6467TCUT1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6446BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TCI6638K2KASAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467TZUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

SCANSTA112VSX

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

3 V

85 Cel

-40 Cel

TIN LEAD

QUAD

1.2 mm

14 mm

260

14 mm

CMOS

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G100

3

Not Qualified

e0

TMS320DM6467TZUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

MSP430F67751IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

131072

16

14 mm

0

30

260

20 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

TCI6630K2LXCMSA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

MSP430F6746AIPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

TMS320DM355DZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

MSP430F6745IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

131072

16

14 mm

0

25 MHz

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

MSP430F67461AIPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

MSP430F67651IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

131072

16

14 mm

0

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

TMS320DM6446BZWT8

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

TCI6638K2KAXAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6443ZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

MSP430F67481AIPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

TCI6636K2HDXAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

CC1310F32RGZ

Texas Instruments

MICROPROCESSOR CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

QUAD

1 mm

7 mm

7 mm

CMOS

.5 mm

S-PQCC-N48

MSP430F6777IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

32

14 mm

0

25 MHz

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

TCI6638K2KSAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

MSP430F6777AIPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

TCI6636K2HAAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467CZUTV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS37F158LGIDBTRG4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

30

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

0

30

260

CMOS

SPI; UART; USART

R-PDSO-G30

2

e4

TMS320DM6443AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

MSP430F6747IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

32

14 mm

0

25 MHz

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MSP430F6768AIPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

16

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

16384

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.