MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
ATWINC3400-MR210CA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	4.2 V	TS 16949				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		2.087 mm			14.732 mm						30	260	22.428 mm		CMOS			3.6 V						1.204 mm		R-XXMA-N37
ESP32-WROOM-32E(M113EH3200PH3Q0)	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		3.25 mm			18 mm								25.5 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N38
ATWINC1500-MR210UB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V								R-XXMA-N28
ESP32-WROOM-32E	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		3.25 mm			18 mm						30	250	25.5 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N38	3
AR1100-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			5 mm		ALSO OPERATES AT 5V SUPPLY						5 mm		CMOS			3.3 V						.65 mm		S-PQCC-N20			e3
P82B715DR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified	e4
MFRC52202HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD											30	260					100 mA			Other Microprocessor ICs				.5 mm		S-PQCC-N32	1	Not Qualified
ATSAMA5D27-SOM1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	176	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY	MODULE,176LEAD	3 V	85 Cel		-40 Cel			UNSPECIFIED		2.8 mm			38 mm		UPTO 4 FLEXCOMM AVAILABLE				NOT SPECIFIED	NOT SPECIFIED	40 mm		CMOS			3.3 V					CAN(2), I2C, I2S, QSPI, SSC, SDMMC, SPI, UART(4)	.8 mm		R-XXMA-N176
NRF52810-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			5 mm						NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS			3 V						.5 mm		S-XQCC-N32
P82B715TD,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.75 mm			3.9 mm						30	260	4.9 mm		BIPOLAR			5 V						1.27 mm		R-PDSO-G8	1	Not Qualified	e4
ESP32-C3FN4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel		-40 Cel			QUAD		.9 mm			5 mm		ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY						5 mm		CMOS			3.3 V						.5 mm		S-PQCC-N32
MCP2221-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				SMALL OUTLINE	SOP14,.24	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS			3.3 V						1.27 mm		R-PDSO-G14			e3
AR1100-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949				SMALL OUTLINE, SHRINK PITCH		3.135 V	85 Cel		-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm		ALSO OPERATES AT 5V SUPPLY				40	260	7.2 mm		CMOS			3.3 V						.65 mm		R-PDSO-G20	2	Not Qualified	e3
NRF52810-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS			3 V						.4 mm		S-XQCC-N48
PGA460TPWQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS			12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2		e4
FT230XQ-U	FTDI	MICROPROCESSOR CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED			CMOS
AR1100-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949				SMALL OUTLINE	SOP20,.4	3.135 V	85 Cel		-40 Cel	MATTE TIN		DUAL		2.65 mm			7.5 mm		ALSO OPERATES AT 5V SUPPLY					260	12.8 mm		CMOS			3.3 V						1.27 mm		R-PDSO-G20	1	Not Qualified	e3
NRF52810-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			5 mm						NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS			3 V						.5 mm		S-XQCC-N32
P82B715DRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified	e4
NRF52810-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS			3 V						.4 mm		S-XQCC-N48
XCZU4EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V					GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V								R-PBGA-B784	4		e1
MFRC52202HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD											30	260					100 mA			Other Microprocessor ICs				.5 mm		S-PQCC-N32	1	Not Qualified
MCP2221-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949			3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm			4.4 mm								5 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers				.65 mm		R-PDSO-G14		Not Qualified	e3
NRF52810-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			5 mm						NOT SPECIFIED	NOT SPECIFIED	5 mm		CMOS			3 V						.5 mm		S-XQCC-N32
ESP32-C3FH4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel		-40 Cel			QUAD		.9 mm			5 mm		ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY						5 mm		CMOS			3.3 V						.5 mm		S-PQCC-N32
ESP32-C3	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	105 Cel		-40 Cel			QUAD		.9 mm			5 mm		ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY						5 mm		CMOS			3.3 V						.5 mm		S-PQCC-N32
FT245RL-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V					SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel			DUAL		2 mm			5.3 mm						40	260	10.2 mm		CMOS									.65 mm		R-PDSO-G28	3	Not Qualified
CY8CMBR3116-LQXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		.55 mm			4 mm		Capacitive Touch Sense Controller						4 mm		CMOS			1.8 V						.5 mm		S-XQCC-N24	3		e4
NRF52810-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel			QUAD		.95 mm			6 mm						NOT SPECIFIED	NOT SPECIFIED	6 mm		CMOS			3 V						.4 mm		S-XQCC-N48
TMS320DM368ZCED48F	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
RN2903A-I/RM105	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.8 mm							250	26.7 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N47			e4
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V					FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN		QUAD		1.6 mm			7 mm						30	260	7 mm		CMOS			5 V						.8 mm		S-PQFP-G32	3		e3
AR1100T-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949				SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	3.135 V	85 Cel		-40 Cel	MATTE TIN		DUAL		2 mm			5.3 mm		ALSO OPERATES AT 5V SUPPLY				40	260	7.2 mm		CMOS			3.3 V						.65 mm		R-PDSO-G20	2	Not Qualified	e3
CC2541F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified	e4		23
CC3220MODASF12MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO			CHIP CARRIER		2.3 V	85 Cel		-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0		TIMER(4), WDT	0		30	260	25 mm	262144	CMOS	4-Ch 12-Bit		3.3 V	NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3		e4	8	25
ATWINC1500-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949				MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel			UNSPECIFIED		2.11 mm			14.73 mm					48 MHz			21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210UB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm								21.72 mm		CMOS			3.3 V								R-XXMA-N28
MFRC52201HN1,115	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD											30	260					100 mA			Other Microprocessor ICs				.5 mm		S-PQCC-N32	1	Not Qualified
PGA460TPWRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS			12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2		e4
CC1310F128RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS			3.3 V						.5 mm		S-PQCC-N32	3		e4
ATWINC1500-MR210UB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V					MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V								R-XXMA-N28
FT245BL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V					FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN		QUAD		1.6 mm			7 mm						30	260	7 mm		CMOS			5 V						.8 mm		S-PQFP-G32	3	Not Qualified	e3
FT245RQ-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel			QUAD		1 mm			5 mm								5 mm		CMOS									.5 mm		S-XQCC-N32	3	Not Qualified
INEMO-M1	STMicroelectronics	MICROPROCESSOR CIRCUIT
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD											30	260					100 mA			Other Microprocessor ICs				.5 mm		S-PQCC-N32	1	Not Qualified
P82B715D	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V					SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified	e4
NRF52811-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.5 mm		S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.