MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCZU11EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS		.85 V					1 mm	R-PBGA-B1517	4			e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
MSP430F6748IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1.6 mm	524288		14 mm				0	25 MHz	30	260	20 mm	16384	CMOS	11.75 mA	3.3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3	Not Qualified	25 rpm	e4
QCA7000-AL3C	Qualcomm	MICROPROCESSOR CIRCUIT
SCANSTA112SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.5 mm			10 mm				0		30	260	10 mm		CMOS		3.3 V		Other Microprocessor ICs			.8 mm	S-PBGA-B100	4	Not Qualified		e1
XCZU11EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B1760	4			e1
XCZU5CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V						R-PBGA-B900	4			e1
CC1310F64RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS		3.3 V					.4 mm	S-PQCC-N32	3			e4
MC13213R2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	71	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.4 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	NICKEL GOLD		BOTTOM		1 mm			9 mm						30	250	9 mm		CMOS		2.7 V					.5 mm	S-PBGA-B71	3	Not Qualified		e4
NT3H2211W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																				NICKEL PALLADIUM GOLD													30	260												1			e4
UCD3138A64PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO	1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS		3.3 V	NO			I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4	8	43
XCZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V						R-PBGA-B784	4			e1
MCP25050T-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949	8			5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS		5 V		Parallel IO Port			1.27 mm	R-PDSO-G14	1	Not Qualified		e3
MKW41Z512VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD											40	260			CMOS		3.3 V						S-XQCC-N48	3			e4
XCZU2CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V						S-PBGA-B784	4			e1
XCZU4EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V						R-PBGA-B784	4			e1
XCZU5CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B900	4			e1
ATWINC1510-MR210PB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V						MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm		SEATED HGT-NOM						21.72 mm		CMOS		3.6 V						R-XXMA-N28
CC1310F64RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V					.5 mm	S-PQCC-N32	3			e4
FXLC95000CLR1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	24	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM		1.1 mm			3 mm						40	260	5 mm		CMOS		1.8 V					.5 mm	R-PBGA-B24	3
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS		1.8 V					.5 mm	R-PBGA-B153				e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V				I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel		-25 Cel			BOTTOM		1 mm			11.5 mm								13 mm		CMOS		3.3 V					.5 mm	R-PBGA-B153
XCZU7EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS		.85 V					1 mm	R-PBGA-B1517	4			e1
XCZU7EG-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.9 V						R-PBGA-B1517	4			e1
XCZU7EG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V						R-PBGA-B900	4			e1
CC1310F128RGZ	Texas Instruments	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V						QUAD		1 mm			7 mm								7 mm		CMOS							.5 mm	S-PQCC-N48
MCP2221T-I/ST	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949				3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP14,.25	3 V	85 Cel		-40 Cel	MATTE TIN		DUAL		1.2 mm			4.4 mm								5 mm		CMOS	15 mA	3.3 V		Serial IO/Communication Controllers			.65 mm	R-PDSO-G14		Not Qualified		e3
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS						13 mm		CMOS		1.8 V					.5 mm	R-PBGA-B153				e1
SSD1926QL9	Solomon Systech	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.98 V						FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1.62 V	85 Cel		-30 Cel			QUAD		1.6 mm			14 mm								14 mm		CMOS		1.8 V					.4 mm	S-PQFP-G128
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES						3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel		-25 Cel			BOTTOM												260				260 mA	3.3 V		Other Microprocessor ICs			.8 mm	S-PBGA-B64	2	Not Qualified
UCD3138128APFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.2 mm			12 mm				0	2 MHz	30	260	12 mm		CMOS		3.3 V				I2C; SPI; UART	.5 mm	S-PQFP-G80	3			e4
XCZU7EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B1517	4			e1
CC2543RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			5 mm				0		30	260	5 mm		CMOS		3 V		Other uPs/uCs/Peripheral ICs		I2C; SPI; UART; USART	.5 mm	S-PQCC-N32	3	Not Qualified		e4
OMAPL138EZCEA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	13 mm		CMOS		1.3 V					.65 mm	S-PBGA-B361	3			e1
XCZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS		.85 V						R-PBGA-B625	4			e1
XCZU5CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS		.85 V						S-PBGA-B784	4			e1
XCZU9CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
XCZU1EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250												4			e1
XCZU5EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B900	4			e1
CC430F5147IRGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	32768	4	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	TIMER		20 MHz	30	260	7 mm	4096	CMOS		3.3 V		Microcontrollers	FLASH	I2C; SPI; UART; USB	.5 mm	S-PQCC-N48	3	Not Qualified	20 rpm	e4		30
OMAPL138EZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	13 mm		CMOS		1.3 V				I2C; SPI; UART; USB	.65 mm	S-PBGA-B361	3		456 rpm	e1
TCI6630K2LCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V						GRID ARRAY		.902 V				TIN SILVER COPPER		BOTTOM											30	245			CMOS		.95 V						S-PBGA-B900	4			e1
XCZU11EG-L1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS		.72 V						R-PBGA-B1760	4			e1
XCZU15EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B900	4			e1
XCZU9EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS		.85 V						R-PBGA-B1156	4			e1
CC1310F32RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS		3.3 V					.5 mm	S-PQCC-N32	3			e4
OMAPL138EZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS		1.3 V				I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.