MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
HT82K628A(40DIP)	Holtek Semiconductor	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO						5	IN-LINE	DIP40,.6		70 Cel		-25 Cel			DUAL															CMOS		5 mA	5 V		Other Microprocessor ICs				2.54 mm	R-PDIP-T40		Not Qualified
LS1021ASE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V						GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm						40	260	19 mm		CMOS			1 V						.8 mm	S-PBGA-B525	3			e1
LTC4263CDE#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel		0 Cel	MATTE TIN		DUAL		.8 mm			3 mm						30	260	4 mm		CMOS			5 V						.5 mm	R-PDSO-N14	1	Not Qualified		e3
MAXQ1061EUD+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES										109 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL											30	260			CMOS										R-PDSO-G14	1			e3
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel		-40 Cel			BOTTOM		.8 mm			9 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE		0	.032768 MHz			9 mm		CMOS			1.8 V					I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel		-40 Cel			BOTTOM		.8 mm			9 mm		ALSO OPERATES AT 3.3V NOMINAL VOLATGE		0	.032768 MHz			9 mm		CMOS			1.8 V					I2C, ESPI, UART	.65 mm	S-PBGA-B144
MFRC53101T/0FE,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						3.3/5,5	SMALL OUTLINE	SOP32,.4		85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		DUAL											30	250					150 mA			Other Microprocessor ICs				1.27 mm	R-PDSO-G32	1	Not Qualified		e4
MKW41Z256VHT4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	3.6 V						CHIP CARRIER		1.71 V	105 Cel		-40 Cel	NICKEL GOLD		QUAD											40	260			CMOS			3.3 V							S-XQCC-N48	3			e4
MSP430F67471IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	262144	32	14 mm				0		30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67641AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V						FLATPACK, LOW PROFILE, FINE PITCH		1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm		8	14 mm				0		30	260	14 mm	8192	CMOS			3.3 V					I2C; SPI; UART	.5 mm	S-PQFP-G100	3			e4
MSP430F67651AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67751AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	131072	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F67781AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0	NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	16	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	16384	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
MSP430F6778IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	16	14 mm				0	25 MHz	30	260	14 mm	16384	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm	S-PQFP-G100	3	Not Qualified	25 rpm	e4
NT3H1201W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER		1.7 V	95 Cel		-40 Cel			QUAD		.5 mm			1.6 mm							260	1.6 mm		CMOS										S-PQCC-N8	1
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3		456 rpm	e1
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES					32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN		QUAD			131072								30	260		8192	CMOS		150 mA			Microcontrollers		FLASH		.5 mm	S-PQCC-N40	3	Not Qualified	24 rpm	e3
STWBC-EPTR	STMicroelectronics	MICROPROCESSOR CIRCUIT																																	NOT SPECIFIED	NOT SPECIFIED
STWBCTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			105 Cel		-40 Cel			QUAD		1 mm			5 mm								5 mm		CMOS			5 V						.5 mm	S-XQCC-N32
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm				32		30	260	13 mm		CMOS			1.35 V					I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3			e1
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1760	4			e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1517	4			e1
XCZU11EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V						GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.9 V							R-PBGA-B1156	4			e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1924	4			e1
XCZU1CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1EG-1UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT																				TIN SILVER BISMUTH COPPER NICKEL													30	245														4
XCZU1EG-2SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU1EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT																				Tin/Silver/Copper (Sn/Ag/Cu)													30	250														4			e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS			.85 V							R-PBGA-B484	4			e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS			.72 V							R-PBGA-B484	4			e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B900	4			e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	250			CMOS			.72 V							R-PBGA-B784	4			e1
XCZU4EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B900	4			e1
XCZU5CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V							S-PBGA-B784	4			e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, FINE PITCH			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS			.85 V						.8 mm	S-PBGA-B784	4			e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS			.72 V							S-PBGA-B784	4			e1
XCZU5EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V							R-PBGA-B784	4			e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V						GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B1517	4			e1
ZGM230SA27HGN2	Silicon Labs	MICROPROCESSOR CIRCUIT
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel		-40 Cel			BOTTOM		1 mm			7 mm								7 mm		CMOS			3.3 V						.65 mm	S-PBGA-B100
ATTPM20P-H6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel			DUAL		.6 mm			2 mm								3 mm		CMOS			3.3 V					SPI	.5 mm	R-PDSO-N8

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.