MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MSP430F67791IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MTFC16GJDDQ-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, LOW PROFILE

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

30

260

18 mm

CMOS

3.3 V

1 mm

R-PBGA-B100

e1

OMAPL138EZCE4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

QCA7000-AL3B-R

Qualcomm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU1CG-L1UBVA494I

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU4EG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7CG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7CG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7CG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XQ7Z100-2RF900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

BOTTOM

3.44 mm

31 mm

NOT SPECIFIED

NOT SPECIFIED

31 mm

CMOS

1 mm

S-PBGA-B900

1SX085HN3F43E1VG

Intel

MICROPROCESSOR CIRCUIT

80312

Intel

MICROPROCESSOR CIRCUIT

BALL

540

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3 V

BOTTOM

4.1 mm

42.5 mm

42.5 mm

CMOS

3.3 V

1.27 mm

S-PBGA-B540

Not Qualified

ATWINC1500-MR210UB

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

MATTE TIN

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

21.72 mm

CMOS

3.6 V

R-XXMA-N28

e3

MCP25055-I/P

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

TS 16949

8

3/5

IN-LINE

DIP14,.3

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

4.318 mm

7.62 mm

19.05 mm

CMOS

5 V

Parallel IO Port

2.54 mm

R-PDIP-T14

Not Qualified

e3

MCP25055-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MCP25055T-I/SL

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

TS 16949

8

3/5

SMALL OUTLINE

SOP14,.24

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

1.75 mm

3.9 mm

8.65 mm

CMOS

5 V

Parallel IO Port

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MKW21Z512VHT4

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER

1.71 V

105 Cel

-40 Cel

NICKEL GOLD

QUAD

40

260

CMOS

3.3 V

S-XQCC-N48

3

e4

RF430FRL154HCRGER

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

24

VQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, VERY THIN PROFILE

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4 mm

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

0

30

260

4 mm

CMOS

I2C; SPI

.5 mm

S-PQCC-N24

2

e4

STSPIN32F0601

STMicroelectronics

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

STSPIN32F0BTR

STMicroelectronics

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

TCI6630K2LSCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LSCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TW8816-LB3-GRS

Renesas Electronics

MICROPROCESSOR CIRCUIT

MATTE TIN

3

e3

XCVC1902-2HSIVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.854 V

110 Cel

-40 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.88 V

.92 mm

S-PBGA-B1760

XCVC1902-2LLIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.724 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.676 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.7 V

.92 mm

S-PBGA-B2197

e1

XCZU17EG-2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU1EG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU2CG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B484

4

e1

XCZU2CG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B625

4

e1

XCZU7CG-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU7EV-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-L2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XUF216-512-TQ128-I20A

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

85 Cel

-40 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

ADSP-SC583CBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

95 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

AR1100T-I/SO

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.465 V

TS 16949

SMALL OUTLINE

SOP20,.4

3.135 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

ALSO OPERATES AT 5V SUPPLY

12.8 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G20

Not Qualified

e3

ATWINC3400-MR210CA143

Microchip Technology

MICROPROCESSOR CIRCUIT

CC1310F64RGZ

Texas Instruments

MICROPROCESSOR CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

QUAD

1 mm

7 mm

7 mm

CMOS

.5 mm

S-PQCC-N48

CC430F6147IRGCT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD SILVER

YES

QUAD

1 mm

32768

4

9 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

0

20 MHz

30

260

9 mm

4096

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART; USB

.5 mm

S-PQCC-N64

3

Not Qualified

20 rpm

e4

CYPD3125-40LQXIT

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

21.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

3

e4

DLPC900ZPC

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY

BGA516,26X26,40

1.1 V

55 Cel

0 Cel

BOTTOM

2.42 mm

27 mm

16

20 MHz

27 mm

CMOS

1.15 V

I2C; SPI; UART; USB

1 mm

S-PBGA-B516

9

DS2465P+T

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

SMALL OUTLINE

2.97 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.5 mm

3.76 mm

30

260

3.94 mm

CMOS

3.3 V

1.27 mm

R-PDSO-C6

1

e3

ECE1200-I/LD

Microchip Technology

MICROPROCESSOR CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2SQ,16

1.71 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

5 mm

CMOS

1.8 V

.4 mm

S-PQCC-N40

FCM8531RQY

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

FLATPACK, LOW PROFILE

QFP32,.35SQ,32

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

5 V

I2C; SPI; UART

.8 mm

S-PQFP-G32

FM31256-G

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SERIAL, FIXED PROTOCOL

5.5 V

3/5

SMALL OUTLINE

SOP14,.25

N

2.7 V

85 Cel

-40 Cel

PURE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.64 mm

CMOS

SECONDS

3 V

Timer or RTC

1.27 mm

R-PDSO-G14

3

Not Qualified

NO

FT201XQ-U

FTDI

MICROPROCESSOR CIRCUIT

CMOS

HCTL-2021

Broadcom

MICROPROCESSOR CIRCUIT

INDUSTRIAL

PIN/PEG

20

RECTANGULAR

UNSPECIFIED

NO

5.5 V

MICROELECTRONIC ASSEMBLY

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

260

CMOS

5 V

R-XDMA-P20

Not Qualified

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.