MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU4CG-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU5CG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.88 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

DM355SDZCEA216

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

MSP430F67641AIPNR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

12 mm

0

30

260

12 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G80

3

e4

MXD1210EWE

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MXD1210EWE+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

30

260

9.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e3

TCI6630K2LXCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TDA8029HL/C207

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

FLATPACK, LOW PROFILE

2.7 V

90 Cel

-40 Cel

QUAD

1.6 mm

7 mm

7 mm

CMOS

3.3 V

.8 mm

S-PQFP-G32

VCBUSAM6467CT

Texas Instruments

MICROPROCESSOR CIRCUIT

TIN SILVER COPPER

30

245

4

e1

XCVM1802-1MSEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

e1

XCZU1EG-1UBVA494I

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

ADSP-SC589-ENG

Analog Devices

MICROPROCESSOR CIRCUIT

BALL

529

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

BOTTOM

1.5 mm

19 mm

19 mm

CMOS

1.1 V

.8 mm

S-PBGA-B529

DH82Q87SR173

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

UNSPECIFIED

CMOS

MXD1210CWE

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MXD1210CWE+

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

30

260

9.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e3

OMAPL138EZCED4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

TCI6630K2LXCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TIR1000PSRG4

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

2 mm

5.3 mm

CAN ALSO OPERATE AT 5V SUPPLY

30

260

6.2 mm

CMOS

3 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e4

TMS320DM365ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

XCZU1EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

1SX280LN2F43I2VGAS

Intel

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

21.72 mm

CMOS

3.6 V

R-XXMA-N28

ADSP-21583BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

ATWINC3400-MR210CA122-T

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.087 mm

14.732 mm

SEATED HGT-CALCULATED

NOT SPECIFIED

NOT SPECIFIED

22.428 mm

CMOS

3.6 V

1.204 mm

R-XXMA-N36

CC430F5145IRGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

2

7 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

TIMER

0

20 MHz

30

260

7 mm

2048

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART; USB

.5 mm

S-PQCC-N48

3

Not Qualified

20 rpm

e4

30

CC430F6147IRGCR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.35SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD SILVER

YES

QUAD

1 mm

32768

4

9 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

0

20 MHz

30

260

9 mm

4096

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART; USB

.5 mm

S-PQCC-N64

3

Not Qualified

20 rpm

e4

D2-71083-LR

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.9 V

FLATPACK, LOW PROFILE, FINE PITCH

1.7 V

85 Cel

-10 Cel

MATTE TIN

QUAD

1.6 mm

14 mm

30

260

14 mm

CMOS

1.8 V

.4 mm

S-PQFP-G128

3

e3

DLPC3439CZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

1 mm

13 mm

30

260

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

3

e1

MSP430F67761IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

262144

16

14 mm

0

30

260

14 mm

16384

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

RF430FRL153HCRGER

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

24

VQCCN

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER, VERY THIN PROFILE

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

4 mm

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

0

30

260

4 mm

CMOS

I2C; SPI

.5 mm

S-PQCC-N24

2

e4

SA3229-E1-T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

R-PBCC-B25

STSPIN32F0602

STMicroelectronics

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

XCZU11EG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU1EG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU4EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

AX-SFUS-API-1-01-TB05

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-XQCC-N40

1

CC430F5123IRGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

2

7 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

TIMER

0

20 MHz

30

260

7 mm

2048

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART; USB

.5 mm

S-PQCC-N48

3

Not Qualified

20 rpm

e4

30

CC430F5125IRGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

2

7 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

TIMER

0

20 MHz

30

260

7 mm

2048

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQCC-N48

3

Not Qualified

20 rpm

e4

30

CC430F5143IRGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8192

2

7 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

TIMER

0

20 MHz

30

260

7 mm

2048

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQCC-N48

3

Not Qualified

20 rpm

e4

30

DS8023-RJX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.1 mm

4.4 mm

30

260

9.7 mm

CMOS

215 mA

3.3 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

1

Not Qualified

e3

DS8023-RJX+T&R

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.1 mm

4.4 mm

ALSO AVAILABLE IN 5V

30

260

9.7 mm

CMOS

3.3 V

.65 mm

R-PDSO-G28

1

e3

DS8023-RRX+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

2.65 mm

7.5 mm

30

260

17.9 mm

CMOS

215 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

1

Not Qualified

e3

DS8023-RRX+T&R

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

2.65 mm

7.5 mm

ALSO AVAILABLE IN 5V

30

260

17.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G28

1

e3

FH82CM246SR40E

Intel

MICROPROCESSOR CIRCUIT

RECTANGULAR

UNSPECIFIED

CMOS

LTC4263IDE-1#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263IS#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

MKW41Z512CAT4R

NXP Semiconductors

MICROPROCESSOR CIRCUIT

40

260

1

MSP430F67491IPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

30

260

14 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

Not Qualified

25 rpm

e4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.