MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XA7Z020-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MPXY8500DK016T1

NXP Semiconductors

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

32

HQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG

1.8 V

125 Cel

-40 Cel

QUAD

2.3 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

3 V

.65 mm

S-XQCC-N32

MSP430F67641AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

8

14 mm

0

30

260

14 mm

8192

CMOS

3.3 V

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

e4

QCA7000-AL3B

Qualcomm

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CMOS

XCZU4EV-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XUF216-512-TQ128-C20A

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

CC1310F32RSMR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

LTC4263IDE-1#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

MC13212

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BUTT

71

VFLGA

SQUARE

PLASTIC/EPOXY

YES

3.4 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2 V

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

1 mm

9 mm

30

250

9 mm

CMOS

2.7 V

.5 mm

S-PBGA-B71

3

Not Qualified

e4

MSP430F6779AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6779IPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

25 MHz

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

MSP430F6779IPEUR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

1.8 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

1.6 mm

524288

32

14 mm

0

25 MHz

30

260

20 mm

32768

CMOS

11.75 mA

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

Not Qualified

25 rpm

e4

OMAPL138EZCED4E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

XCZU5EV-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU7EV-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

CMX7341Q3

Cml Microcircuits

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

QUAD

1 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N48

QCA7000-AL3C-R

Qualcomm

MICROPROCESSOR CIRCUIT

TCI6630K2LCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6630K2LDCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TCI6630K2LDCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

TDA8029HL/C207,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8/5,3/5

FLATPACK

QFP32,.35SQ,32

90 Cel

-40 Cel

QUAD

260

Other Microprocessor ICs

.8 mm

S-PQFP-G32

1

Not Qualified

TMS320DM6446AZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

XAZU5EV-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU1CG-1UBVA494E

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU1CG-1UBVA494I

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU4CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

CC1310F64RGZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

7 mm

30

260

7 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N48

3

e4

MSP430F6777AIPZ

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F67791AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

MSP430F6779AIPEU

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

524288

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

20 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

R-PQFP-G128

3

25 rpm

e4

8

90

OMAPL138EZCE3

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

13 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B361

3

456 rpm

e1

SCANSTA111MT/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.1 mm

6.1 mm

30

260

12.5 mm

CMOS

3.3 V

Other Microprocessor ICs

.5 mm

R-PDSO-G48

2

Not Qualified

e3

STSPIN32F0602TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

XCZU11EG-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU19EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU1CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU4CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU7EG-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.97 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XCZU7EG-3FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU7EG-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU7EG-L2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XVF3000-TQ128-CA

Xmos

MICROPROCESSOR CIRCUIT

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1.05 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.95 V

70 Cel

0 Cel

QUAD

1.2 mm

14 mm

14 mm

CMOS

1 V

.4 mm

S-PQFP-G128

A13

Allwinner Technology

MICROPROCESSOR CIRCUIT

GULL WING

176

HQFP

UNSPECIFIED

PLASTIC/EPOXY

YES

FLATPACK, HEAT SINK/SLUG

QUAD

CMOS

X-PQFP-G176

AR1100T-I/MQ

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.465 V

TS 16949

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

3.135 V

85 Cel

-40 Cel

MATTE TIN

QUAD

1 mm

5 mm

ALSO OPERATES AT 5V SUPPLY

5 mm

CMOS

3.3 V

.65 mm

S-PQCC-N20

e3

ATTPM20P-G3MA1-10-B

Microchip Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.3 V

TS 16949

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.11,20

1.8 V

70 Cel

0 Cel

DUAL

.6 mm

2 mm

3 mm

CMOS

SPI

.5 mm

R-PDSO-N8

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.