MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XCC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm		CMOS			3 V						.5 mm	S-PQCC-N48	3			e4
PGA460TPW	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS			12 V					SPI; UART; USART	.65 mm	R-PDSO-G16	2			e4
ATWINC1500-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel			UNSPECIFIED		2.11 mm			14.73 mm					48 MHz	NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V							R-XXMA-N28
NT3H2111W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.67 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		.5 mm			1.6 mm						30	260	1.6 mm		CMOS			1.8 V						.5 mm	S-PQCC-N8	1			e4
ATWINC1500-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm		CMOS			3.3 V							R-XXMA-N28
CC1310F128RSMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		1 mm			4 mm						30	260	4 mm	28672	CMOS			3.3 V						.4 mm	S-PQCC-N32	3			e4
CC1312R1F3RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			7 mm		DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF				30	260	7 mm	81920	CMOS			3 V						.5 mm	S-PQCC-N48	3			e4		30
FT245RQ-TRAY	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel			QUAD		1 mm			5 mm						40	260	5 mm		CMOS									.5 mm	S-XQCC-N32	3	Not Qualified
CC1310F64RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS			3.3 V						.5 mm	S-PQCC-N48	3			e4
STSPIN32F0	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel		-40 Cel			QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS									.5 mm	S-XQCC-N48
CC1310F128RHBT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm	28672	CMOS			3.3 V						.5 mm	S-PQCC-N32	3			e4
XCZU5CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY						Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)				30	250			CMOS			.72 V							S-PBGA-B784	4			e1
NRF52811-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS			3 V						.4 mm	S-XQCC-N48
MSP430F6779AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm	R-PQFP-G128	3		25 rpm	e4	8	90
CC1310F32RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			4 mm						NOT SPECIFIED	260	4 mm	28672	CMOS			3.3 V						.4 mm	S-PQCC-N32	3			e4
XCZU4EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
CC1310F128RSMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		1 mm			4 mm						30	260	4 mm	28672	CMOS			3.3 V						.4 mm	S-PQCC-N32	3			e4
NRF52811-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel			QUAD		.9 mm			6 mm								6 mm		CMOS			3 V						.4 mm	S-XQCC-N48
CC2541F128RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		23
FT800Q-R	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel			QUAD		1 mm			7 mm								7 mm		CMOS			3.3 V						.5 mm	S-XQCC-N48	3
MCP25050-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm								8.65 mm		CMOS			5 V		Parallel IO Port				1.27 mm	R-PDSO-G14	1	Not Qualified		e3
XCZU4EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		3.32 mm			23 mm						30	250	23 mm		CMOS			.85 V						.8 mm	R-PBGA-B784	4			e1
CC2541F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		23
MTCH6102-I/MV	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	TS 16949						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.16SQ,16	1.8 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.55 mm			4 mm						40	260	4 mm		CMOS			3 V						.4 mm	S-PQCC-N28	1			e3
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES								UNCASED CHIP			50 Cel		0 Cel			UPPER											NOT SPECIFIED	NOT SPECIFIED			CMOS			3.3 V							R-XUUC-N
NHS3100/A1Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																																			260														3
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES							3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel			QUAD											30	260					100 mA			Other Microprocessor ICs				.5 mm	S-PQCC-N32	1	Not Qualified
MCP25020-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN		DUAL		4.318 mm			7.62 mm								19.05 mm		CMOS			5 V		Parallel IO Port				2.54 mm	R-PDIP-T14		Not Qualified		e3
XCZU4EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM		2.88 mm			31 mm						30	245	31 mm		CMOS			.85 V						1 mm	R-PBGA-B900	4			e1
USB4640-HZH-03	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.3 V	TS 16949					1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.1 V	70 Cel		0 Cel	MATTE TIN		QUAD		1 mm			7 mm				0	24 MHz			7 mm		CMOS		60 mA	1.2 V		Bus Controllers				.5 mm	S-PQCC-N48		Not Qualified		e3
XCZU9EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B1156	4			e1
TDA8035HN/C1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V						3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			5 mm						30	260	5 mm		CMOS		220 mA	3.3 V		Other Microprocessor ICs				.5 mm	S-PQCC-N32	1	Not Qualified		e4
STSPIN32F0TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		8 V	125 Cel		-40 Cel			QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS									.5 mm	S-XQCC-N48
NT3H2111W0FTTJ	NXP Semiconductors	MICROPROCESSOR CIRCUIT																					NICKEL PALLADIUM GOLD													30	260														1			e4
CC2541F256RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm			TIMER(4)	0		30	260	6 mm	8192	CMOS			3 V		Other uPs/uCs/Peripheral ICs			I2C; SPI; USART; USB	.5 mm	S-PQCC-N40	3	Not Qualified		e4		23
XCZU2CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	250			CMOS			.85 V							S-PBGA-B784	4			e1
XCZU3EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM											30	250			CMOS			.85 V							R-PBGA-B625	4			e1
FT220XS-T	FTDI	MICROPROCESSOR CIRCUIT																																						CMOS
W5300	Wiznet	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V							FLATPACK, LOW PROFILE, FINE PITCH		3 V	80 Cel		0 Cel			QUAD		1.6 mm			14 mm						40	260	14 mm		CMOS			3.3 V						.5 mm	S-PQFP-G100	3
XCZU7EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B900	4			e1
XCZU7EV-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B1517	4			e1
UCD3138128PFC	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V							FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.2 mm			12 mm						30	260	12 mm		CMOS			3.3 V						.5 mm	S-PQFP-G80	3			e4
NT3H2211W0FHKH	NXP Semiconductors	MICROPROCESSOR CIRCUIT																																		NOT SPECIFIED	260														1
XCZU4EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V							GRID ARRAY		.873 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.9 V							R-PBGA-B900	4			e1
XCZU7EV-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V							R-PBGA-B1156	4			e1
RN2903A-I/RMSA103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD		UNSPECIFIED		3.34 mm			17.78 mm		SEATED HGT-CALCULATED					250	26.67 mm		CMOS			3.3 V						1.27 mm	R-XXMA-N47				e4
XCZU4EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM											30	245			CMOS			.85 V							R-PBGA-B900	4			e1
XCZU7EV-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS			.85 V						1 mm	R-PBGA-B1517	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.