MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

LS1021AXE7KQB

NXP Semiconductors

MICROPROCESSOR CIRCUIT

BALL

525

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.03 V

GRID ARRAY, HEAT SINK/SLUG

.97 V

TIN SILVER COPPER

BOTTOM

2.07 mm

19 mm

40

260

19 mm

CMOS

1 V

.8 mm

S-PBGA-B525

3

e1

MAXQ1061EUD+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

MKW01Z128CHN

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BUTT

60

VBCC

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

.98 mm

8 mm

40

260

8 mm

CMOS

3.3 V

.5 mm

S-PBCC-B60

3

e4

MSP430F6777AIPZR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

0

NO

16

FLATPACK, LOW PROFILE, FINE PITCH

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

YES

QUAD

YES

1.6 mm

262144

32

14 mm

0

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

0

.032768 MHz

30

260

14 mm

32768

CMOS

6-Ch 10-Bit

3.3 V

YES

I2C(2), IRDA(4), SPI(6), UART(4)

FLASH

I2C; SPI; UART

.5 mm

S-PQFP-G100

3

25 rpm

e4

8

62

SCANSTA112VS

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

3 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

1.2 mm

14 mm

0

NOT SPECIFIED

260

14 mm

CMOS

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G100

3

Not Qualified

e0

SCIMX538DZK1C

NXP Semiconductors

MICROPROCESSOR CIRCUIT

BALL

529

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.4 V

0.9/1.25,1.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA529,23X23,32

1.2 V

BOTTOM

.986 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

12 mm

CMOS

1.25 V

Graphics Processors

.5 mm

S-PBGA-B529

Not Qualified

XAZU7EV-1FBVB900Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA900,30X30,40

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.97 mm

31 mm

0

30

245

31 mm

CMOS

.85 V

CAN, I2C, SPI, UART

1 mm

S-PBGA-B900

4

e1

XCZU4CG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU7EG-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.42 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

66AK2L06XCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

UCD3138ARGCR

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

YES

QUAD

1 mm

9 mm

0

2 MHz

30

260

9 mm

CMOS

3.3 V

I2C; UART

.5 mm

S-PQCC-N64

2

e4

XCZU1CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU3CG-1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B484

4

e1

XCZU7EV-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

DM365ZCES

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

32

30

260

13 mm

CMOS

1.35 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B338

3

e1

DM365ZCEW

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

32

30

260

13 mm

CMOS

1.35 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B338

3

e1

DS28CM00R-A00+U

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

5

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE

1.62 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

ALSO AVAILABLE IN 5V

30

260

CMOS

1.8 V

R-PDSO-G5

1

e3

MC68302EH16CR2

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

5.5 V

4.5 V

70 Cel

0 Cel

TIN

UNSPECIFIED

40

260

CMOS

5 V

3

e3

MTFC4GMVEA-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.8 mm

11.5 mm

IT ALSO OPERATES AT 3.3 VOLTS

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

e1

OMAPL132EZWTA2R

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

OMAPL138EZWT4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

STV0991FAH

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

201

TFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

105 Cel

-40 Cel

BOTTOM

1.12 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

1.1 V

.65 mm

S-PBGA-B201

STV0991FAH/TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

201

TFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

105 Cel

-40 Cel

BOTTOM

1.12 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

1.1 V

.65 mm

S-PBGA-B201

TCI6630K2LXCMSA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

XA7Z030-1FBV484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY

125 Cel

-40 Cel

BOTTOM

CMOS

S-PBGA-B484

XAZU4EV-1SFVC784Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU17EG-1FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-L2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1760

4

e1

XCZU1CG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L2UBVA494E

Xilinx

MICROPROCESSOR CIRCUIT

TIN SILVER BISMUTH COPPER NICKEL

30

245

4

XCZU5EV-3SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.9 V

S-PBGA-B784

4

e1

XCZU5EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU6EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7CG-2FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

40 mm

30

245

40 mm

CMOS

.85 V

1 mm

R-PBGA-B1517

4

e1

9LPRS511EGLFT

Integrated Device Technology

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP64,.32,20

70 Cel

0 Cel

TIN

DUAL

260

CMOS

3.3 V

Clock Generators

.5 mm

R-PDSO-G64

1

Not Qualified

e3

CC430F5145IRGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

16

2/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

2.4 V

85 Cel

MSP430

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

16384

2

7 mm

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

TIMER

0

20 MHz

30

260

7 mm

2048

CMOS

3.3 V

Microcontrollers

FLASH

I2C; SPI; UART; USB

.5 mm

S-PQCC-N48

3

Not Qualified

20 rpm

e4

30

STV0991FA

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

201

TFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

105 Cel

-40 Cel

BOTTOM

1.12 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

1.1 V

.65 mm

S-PBGA-B201

STV0991FA/TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

201

TFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

105 Cel

-40 Cel

BOTTOM

1.12 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

1.1 V

.65 mm

S-PBGA-B201

STV0991FAR/TR

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

201

TFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

GRID ARRAY, THIN PROFILE, FINE PITCH

105 Cel

-40 Cel

BOTTOM

1.12 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CMOS

1.1 V

.65 mm

S-PBGA-B201

TCI6630K2LXCMSA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

TIN SILVER COPPER

BOTTOM

30

245

CMOS

.95 V

S-PBGA-B900

4

e1

XCZU1EG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.