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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | SCIMX538DZK1C |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 529; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm; |
| In Stock | 617 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.2 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 1.25 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Supply Voltage: | 1.4 V |
| Maximum Seated Height: | .986 mm |
| Sub-Category: | Graphics Processors |
| Surface Mount: | YES |
| No. of Terminals: | 529 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA529,23X23,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 12 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B529 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | VFBGA |
| Width: | 12 mm |
| Terminal Pitch: | .5 mm |
| Power Supplies (V): | 0.9/1.25,1.3 |
