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| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | MCIMX6L8DVN10AB |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40; |
| Datasheet | MCIMX6L8DVN10AB Datasheet |
| In Stock | 1,569 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.375 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Voltage: | 1.5 V |
| Maximum Seated Height: | 1.1 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER OVER NICKEL |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 432 |
| Package Equivalence Code: | BGA432,24X24,20 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Length: | 13 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B432 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 95 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | TFBGA |
| Width: | 13 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
