MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU1CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU3CG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B625

4

e1

XCZU3CG-L2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B625

4

e1

XCZU4CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

S-PBGA-B784

4

e1

XCZU4EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU5EV-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU7CG-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

XCZU7EG-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-L1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XCZU9CG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9EG-3FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU9EG-3FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B900

4

e1

XCZU9EG-L1FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

ZL30250LDF1

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

5 mm

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

1SX085HN3F43I2LG

Intel

MICROPROCESSOR CIRCUIT

1SX110HN1F43E1VG

Intel

MICROPROCESSOR CIRCUIT

AD6620ASZ

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK

QFP80,.7SQ

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

3.4 mm

14 mm

260

14 mm

CMOS

3.3 V

DSP Peripherals

.65 mm

S-PQFP-G80

3

Not Qualified

e3

AX-SIP-SFEU-1-01-TX30

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BUTT

44

HVBCC

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-30 Cel

NICKEL GOLD PALLADIUM

BOTTOM

.996 mm

7 mm

30

260

9 mm

CMOS

3 V

R-XBCC-B44

3

CC2540TF256RHAT

Texas Instruments

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

8

6 mm

30

260

6 mm

8192

CMOS

3 V

SPI; USART; USB

.5 mm

S-PQCC-N40

3

e4

21

CY8C20237-24LKXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

16

VQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5

CHIP CARRIER, VERY THIN PROFILE

LCC16,.12SQ,20

1.71 V

85 Cel

M8C

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

8192

3 mm

30

260

3 mm

1024

CMOS

4 mA

3.3 V

Microcontrollers

FLASH

.5 mm

S-XQCC-N16

3

Not Qualified

25.2 rpm

e4

DLPC900AZPC

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY

BGA516,26X26,40

1.1 V

55 Cel

0 Cel

BOTTOM

2.42 mm

27 mm

16

20 MHz

27 mm

CMOS

1.15 V

I2C; SPI; UART; USB

1 mm

S-PBGA-B516

9

DS3655B+

Analog Devices

MICROPROCESSOR CIRCUIT

BALL

16

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3 V

85 Cel

-40 Cel

BOTTOM

CMOS

3.3 V

S-PBGA-B16

3

DS3655B+TRL

Analog Devices

MICROPROCESSOR CIRCUIT

BALL

16

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY

3 V

85 Cel

-40 Cel

BOTTOM

CMOS

3.3 V

S-PBGA-B16

3

HPA01216RHAR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

6 mm

TIMER(4)

30

260

6 mm

8192

CMOS

3 V

.5 mm

S-PQCC-N40

3

e4

23

MAXQ1065GTC+T

Analog Devices

MICROPROCESSOR CIRCUIT

Matte Tin (Sn) - annealed

30

260

1

e3

MC13211

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BUTT

71

VFLGA

SQUARE

PLASTIC/EPOXY

YES

3.4 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2 V

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

1 mm

9 mm

30

250

9 mm

CMOS

2.7 V

.5 mm

S-PBGA-B71

3

Not Qualified

e4

MXD1210EWE-T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MXD1210EWE+T

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e3

NT3H1101W0FHKH

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER

1.7 V

95 Cel

-40 Cel

QUAD

.5 mm

1.6 mm

260

1.6 mm

CMOS

S-PQCC-N8

1

NT3H1101W0FTTJ

NXP Semiconductors

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

260

1

NT3H2211W0FTT

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.67 V

105 Cel

-40 Cel

DUAL

1.1 mm

3 mm

3 mm

CMOS

1.8 V

.65 mm

S-PDSO-G8

SDSDQM-016G-B35

Western Digital

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

UPPER

AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA

NOT SPECIFIED

NOT SPECIFIED

CMOS

X-XUUC-N

SDSDQM-016G-B35A

Western Digital

MICROPROCESSOR CIRCUIT

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

UPPER

AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA

NOT SPECIFIED

NOT SPECIFIED

CMOS

X-XUUC-N

TMS320DM365ZCEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

32

30

260

13 mm

CMOS

1.35 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B338

3

e1

WP32C2W6NFEI-400B2

Microchip Technology

MICROPROCESSOR CIRCUIT

BALL

896

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BGA896(UNSPEC)

TIN SILVER COPPER

BOTTOM

CMOS

S-PBGA-B896

e1

XCVC1902-1MSIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.775 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.8 V

.92 mm

S-PBGA-B2197

e1

XCZU11EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU11EG-3FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1517

4

e1

XCZU11EG-3FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1760

4

e1

XCZU15EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU15EG-L2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B900

4

e1

XCZU17EG-2FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU19EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU19EG-2FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU19EG-2FFVE1924E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1924

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

45 mm

30

245

45 mm

CMOS

.85 V

1 mm

R-PBGA-B1924

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.