MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
TMP82C79P-2	Toshiba	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V		IN-LINE		4.5 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	4.8 mm	15.24 mm					50.7 mm		5 mA	5 V		2.54 mm	R-PDIP-T40		Not Qualified	e0
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS		.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V		.8 mm	S-PBGA-B784	4		e1
XCVC1902-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm					45 mm	CMOS		.7 V		.92 mm	S-PBGA-B2197			e1
XCVC1902-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm					45 mm	CMOS		.8 V		.92 mm	S-PBGA-B2197			e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm					45 mm	CMOS		.8 V		.92 mm	S-PBGA-B2197			e1
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM								CMOS		.7 V			S-PBGA-B784			e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm					23 mm	CMOS		.8 V		.8 mm	S-PBGA-B784			e1
XCVM1102-1MLISFVB625	Xilinx	MICROPROCESSOR CIRCUIT
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM								CMOS		.8 V			S-PBGA-B784			e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm					40 mm	CMOS		.7 V		.92 mm	S-PBGA-B1760			e1
XCVM1802-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm					45 mm	CMOS		.7 V		.92 mm	S-PBGA-B2197			e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm					45 mm	CMOS		.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm					50 mm	CMOS		.8 V		.92 mm	S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm					50 mm	CMOS		.8 V		.92 mm	S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm					50 mm	CMOS		.8 V		.92 mm	S-PBGA-B2785
XCVP1402-2DSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm					50 mm	CMOS		.8 V		.92 mm	S-PBGA-B2785
XCVP1702-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm					55 mm	CMOS		.8 V		.92 mm	S-PBGA-B3340
XCVP1802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm					70 mm	CMOS		.8 V		.92 mm	S-PBGA-B5601
XCVP1802-3DLILSVC4072	Xilinx	MICROPROCESSOR CIRCUIT
XCZU15EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU15EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V			R-PBGA-B1156	4		e1
XCZU17EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU17EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU17EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU19EG-3FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.9 V			R-PBGA-B1760	4		e1
XCZU19EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V			R-PBGA-B1517	4		e1
XCZU1CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT															Tin/Silver/Copper (Sn/Ag/Cu)						30	250								4		e1
XCZU1CG-L2UBVA494E	Xilinx	MICROPROCESSOR CIRCUIT															TIN SILVER BISMUTH COPPER NICKEL						30	245								4
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS		.85 V		.8 mm	R-PBGA-B484	4		e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS		.85 V			R-PBGA-B784	4		e1
XCZU6CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU7CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU7CG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU7EG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU7EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm	31 mm			30	245	31 mm	CMOS		.85 V		1 mm	R-PBGA-B900	4		e1
XCZU9CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			125 Cel	-40 Cel		BOTTOM	3.37 mm	27 mm			NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS				1 mm	S-PBGA-B676
HSA2-040SAA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V		SMALL OUTLINE	SOP28,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2.64 mm	7.49 mm					17.87 mm	CMOS		3.3 V	USB	1.27 mm	R-PDSO-G28	1		e3
HS12-100S0S/12SS30	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE	SOP20,.4		70 Cel	0 Cel		DUAL	2.64 mm	7.49 mm	Touch Screen Microcontroller				12.8 mm	CMOS				1.27 mm	R-PDSO-G20
HSA2-040SCA/A2324	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V				3.135 V	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL						250		CMOS		3.3 V			R-PDSO-G28	1		e3
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm			30	245	25 mm	CMOS		1.05 V		.8 mm	S-PBGA-B900	4		e1
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS		1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS		1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM330WFSBCPZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	18 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.24SQ,20	3.6 V	115 Cel	-40 Cel		QUAD	1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS			SPI	.5 mm	S-XQCC-N32

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.