Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
2.88 mm |
31 mm |
30 |
245 |
31 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
3.32 mm |
23 mm |
30 |
250 |
23 mm |
CMOS |
.85 V |
.8 mm |
R-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
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Analog Devices |
MICROPROCESSOR CIRCUIT |
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Analog Devices |
MICROPROCESSOR CIRCUIT |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
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|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 mm |
1.6 mm |
1.6 mm |
CMOS |
.5 mm |
S-PQCC-N8 |
1 |
e4 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
110 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B1156 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
625 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
110 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
250 |
CMOS |
.72 V |
R-PBGA-B625 |
4 |
e1 |
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|
Onsemi |
MICROPROCESSOR CIRCUIT |
OTHER |
BUTT |
44 |
HVBCC |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2 V |
85 Cel |
-30 Cel |
NICKEL GOLD PALLADIUM |
BOTTOM |
.996 mm |
7 mm |
30 |
260 |
9 mm |
CMOS |
3 V |
R-XBCC-B44 |
3 |
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|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
RECTANGULAR |
UNSPECIFIED |
NO |
3.6 V |
MICROELECTRONIC ASSEMBLY |
1.8 V |
85 Cel |
-40 Cel |
DUAL |
2.5 mm |
13.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
3 V |
1.5 mm |
R-XDMA-N16 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
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Qualcomm |
MICROPROCESSOR CIRCUIT |
BALL |
BGA |
UNSPECIFIED |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
CMOS |
X-PBGA-B |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
1596 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.825 V |
GRID ARRAY |
BGA1596,40X40,36 |
.775 V |
100 Cel |
0 Cel |
BOTTOM |
3.75 mm |
37.5 mm |
37.5 mm |
CMOS |
.8 V |
.92 mm |
S-PBGA-B1596 |
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|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
32768 |
6 mm |
30 |
260 |
6 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.4 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
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|
Renesas Electronics |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
FLATPACK, LOW PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-10 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
30 |
260 |
14 mm |
CMOS |
1.8 V |
.4 mm |
S-PQFP-G128 |
3 |
e3 |
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|
Intel |
MICROPROCESSOR CIRCUIT |
UNSPECIFIED |
SQUARE |
UNSPECIFIED |
UNSPECIFIED |
CMOS |
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|
Onsemi |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BUTT |
25 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
CHIP CARRIER |
LGA25,3X8,27 |
40 Cel |
0 Cel |
BOTTOM |
1.781 mm |
3.18 mm |
NO |
4.218 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5.59 mm |
CMOS |
1.25 V |
.686 mm |
FIXED POINT |
R-PBCC-B25 |
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|
Toshiba |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-25 Cel |
BOTTOM |
1 mm |
11.5 mm |
13 mm |
CMOS |
3.3 V |
.5 mm |
R-PBGA-B153 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.927 V |
GRID ARRAY |
.873 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.9 V |
R-PBGA-B1156 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) |
30 |
250 |
CMOS |
.72 V |
S-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
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|
Analog Devices |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.15 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA529,23X23,32 |
1.05 V |
70 Cel |
0 Cel |
BOTTOM |
1.5 mm |
19 mm |
500 MHz |
30 |
260 |
19 mm |
CMOS |
1.1 V |
SPI; UART |
.8 mm |
S-PBGA-B349 |
3 |
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|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.9 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.18 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7 mm |
40 |
260 |
7 mm |
CMOS |
1.25 V |
.5 mm |
S-PQCC-N48 |
2 |
e3 |
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Intel |
MICROPROCESSOR CIRCUIT |
BALL |
1310 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BOTTOM |
CMOS |
R-PBGA-B1310 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
2785 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.825 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA2785,53X53,36 |
.775 V |
110 Cel |
0 Cel |
BOTTOM |
4.48 mm |
50 mm |
50 mm |
CMOS |
.8 V |
.92 mm |
S-PBGA-B2785 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1760 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.71 mm |
42.5 mm |
30 |
245 |
42.5 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B1760 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
250 |
CMOS |
.72 V |
R-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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Xilinx |
MICROPROCESSOR CIRCUIT |
MILITARY |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.892 V |
MIL-PRF-38535 |
GRID ARRAY |
.808 V |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
40 |
245 |
CMOS |
.85 V |
S-PBGA-B1156 |
4 |
e0 |
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Intel |
MICROPROCESSOR CIRCUIT |
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|
Silicon Labs |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.18 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
7 mm |
7 mm |
CMOS |
1.25 V |
.5 mm |
S-PQCC-N48 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
N |
BOTTOM |
1.6 mm |
17 mm |
30 |
260 |
17 mm |
CMOS |
Other uPs/uCs/Peripheral ICs |
.8 mm |
S-PBGA-B400 |
3 |
Not Qualified |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
1760 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.825 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1760,42X42,36 |
.775 V |
110 Cel |
0 Cel |
BOTTOM |
4 mm |
40 mm |
40 mm |
CMOS |
.8 V |
.92 mm |
S-PBGA-B1760 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
2197 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
.825 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA2197,47X47,36 |
.775 V |
110 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
4 mm |
45 mm |
45 mm |
CMOS |
.8 V |
.92 mm |
S-PBGA-B2197 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1760 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1760 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B784 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
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Xilinx |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1,1.8 |
GRID ARRAY |
BGA676,26X26,40 |
125 Cel |
-40 Cel |
TIN LEAD |
N |
BOTTOM |
3.37 mm |
27 mm |
30 |
225 |
27 mm |
CMOS |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B676 |
4 |
Not Qualified |
e0 |
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Xilinx |
MICROPROCESSOR CIRCUIT |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1,1.8 |
GRID ARRAY |
BGA676,26X26,40 |
TIN LEAD |
N |
BOTTOM |
3.37 mm |
27 mm |
27 mm |
CMOS |
Other uPs/uCs/Peripheral ICs |
1 mm |
S-PBGA-B676 |
Not Qualified |
e0 |
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|
Atmel |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP48,.35SQ,20 |
85 Cel |
-40 Cel |
QUAD |
40 mA |
5 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
Not Qualified |
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|
Cypress Semiconductor |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.6 mm |
16384 |
6 mm |
30 |
260 |
6 mm |
2048 |
CMOS |
4 mA |
3.3 V |
Microcontrollers |
FLASH |
.4 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
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Infineon Technologies |
MICROPROCESSOR CIRCUIT |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.