MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU4CG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

2.88 mm

31 mm

30

245

31 mm

CMOS

.85 V

1 mm

R-PBGA-B900

4

e1

XCZU4EG-2FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU4EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.85 V

.8 mm

R-PBGA-B784

4

e1

XCZU6EG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EG-1FFVF1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

ADSP-SC598BBPZ8

Analog Devices

MICROPROCESSOR CIRCUIT

ADSP-SC598KBPZ8

Analog Devices

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210UB1140

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

21.72 mm

CMOS

3.6 V

R-XXMA-N28

NT3H1101W0FHK

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

8

VQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 mm

1.6 mm

1.6 mm

CMOS

.5 mm

S-PQCC-N8

1

e4

XCZU11EG-1FFVB1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-L2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

XCZU2CG-L2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

625

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

110 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B625

4

e1

AX-SIP-SFEU-API-1-01-TX30

Onsemi

MICROPROCESSOR CIRCUIT

OTHER

BUTT

44

HVBCC

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2 V

85 Cel

-30 Cel

NICKEL GOLD PALLADIUM

BOTTOM

.996 mm

7 mm

30

260

9 mm

CMOS

3 V

R-XBCC-B44

3

SP1ML-868

STMicroelectronics

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

16

RECTANGULAR

UNSPECIFIED

NO

3.6 V

MICROELECTRONIC ASSEMBLY

1.8 V

85 Cel

-40 Cel

DUAL

2.5 mm

13.4 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

CMOS

3 V

1.5 mm

R-XDMA-N16

XCVP1702-3DSEVSVA3340

Xilinx

MICROPROCESSOR CIRCUIT

CSR8675C-ICXT-R

Qualcomm

MICROPROCESSOR CIRCUIT

BALL

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

CMOS

X-PBGA-B

XCVM1402-1MSEVFVC1596

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1596

BGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY

BGA1596,40X40,36

.775 V

100 Cel

0 Cel

BOTTOM

3.75 mm

37.5 mm

37.5 mm

CMOS

.8 V

.92 mm

S-PBGA-B1596

CY8C20667S-24LQXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

1.71 V

85 Cel

M8C

-40 Cel

PURE TIN

QUAD

.6 mm

32768

6 mm

30

260

6 mm

2048

CMOS

4 mA

3.3 V

Microcontrollers

FLASH

.4 mm

S-XQCC-N48

3

Not Qualified

25.2 rpm

D2-71583-LR

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

128

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1.9 V

FLATPACK, LOW PROFILE, FINE PITCH

1.7 V

85 Cel

-10 Cel

MATTE TIN

QUAD

1.6 mm

14 mm

30

260

14 mm

CMOS

1.8 V

.4 mm

S-PQFP-G128

3

e3

DH82QM87SR17C

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

SQUARE

UNSPECIFIED

UNSPECIFIED

CMOS

R3920-CFAB-E1T

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

BUTT

25

BCC

RECTANGULAR

PLASTIC/EPOXY

NO

YES

CHIP CARRIER

LGA25,3X8,27

40 Cel

0 Cel

BOTTOM

1.781 mm

3.18 mm

NO

4.218 MHz

NOT SPECIFIED

NOT SPECIFIED

5.59 mm

CMOS

1.25 V

.686 mm

FIXED POINT

R-PBCC-B25

THGBM5G6A2JBAIR

Toshiba

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-25 Cel

BOTTOM

1 mm

11.5 mm

13 mm

CMOS

3.3 V

.5 mm

R-PBGA-B153

XCVP1802-1HSELSVC4072

Xilinx

MICROPROCESSOR CIRCUIT

XCZU15EG-3FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B1156

4

e1

XCZU3CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

30

250

CMOS

.72 V

S-PBGA-B784

4

e1

XCZU6CG-1FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

ADSP-SC589KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

EM341-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.9 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.18 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

7 mm

40

260

7 mm

CMOS

1.25 V

.5 mm

S-PQCC-N48

2

e3

EY82C621ASRH58

Intel

MICROPROCESSOR CIRCUIT

BALL

1310

RECTANGULAR

PLASTIC/EPOXY

YES

BOTTOM

CMOS

R-PBGA-B1310

XCVP1202-2MSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2785

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA2785,53X53,36

.775 V

110 Cel

0 Cel

BOTTOM

4.48 mm

50 mm

50 mm

CMOS

.8 V

.92 mm

S-PBGA-B2785

XCZU17EG-2FFVC1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.71 mm

42.5 mm

30

245

42.5 mm

CMOS

.85 V

1 mm

R-PBGA-B1760

4

e1

XCZU3EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU9EG-2FFVC900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQZU28DR-1FFRE1156M

Xilinx

MICROPROCESSOR CIRCUIT

MILITARY

BALL

1156

BGA

SQUARE

PLASTIC/EPOXY

YES

.892 V

MIL-PRF-38535

GRID ARRAY

.808 V

125 Cel

-55 Cel

Tin/Lead (Sn/Pb)

BOTTOM

40

245

CMOS

.85 V

S-PBGA-B1156

4

e0

DH82HM86SR17E

Intel

MICROPROCESSOR CIRCUIT

EM3587-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.32 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.18 V

85 Cel

-40 Cel

QUAD

.9 mm

7 mm

7 mm

CMOS

1.25 V

.5 mm

S-PQCC-N48

XA7Z020-1CLG400I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XCVC1902-2MLEVSVD1760

Xilinx

MICROPROCESSOR CIRCUIT

BALL

1760

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA1760,42X42,36

.775 V

110 Cel

0 Cel

BOTTOM

4 mm

40 mm

40 mm

CMOS

.8 V

.92 mm

S-PBGA-B1760

XCVM1802-2MSEVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.775 V

110 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.8 V

.92 mm

S-PBGA-B2197

e1

XCZU19EG-1FFVD1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU5EV-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU6CG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU7EG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z030-1RF676Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA676,26X26,40

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

3.37 mm

27 mm

30

225

27 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B676

4

Not Qualified

e0

XQ7Z045-1RF676I

Xilinx

MICROPROCESSOR CIRCUIT

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY

BGA676,26X26,40

TIN LEAD

N

BOTTOM

3.37 mm

27 mm

27 mm

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B676

Not Qualified

e0

AT43USB326-AU

Atmel

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP48,.35SQ,20

85 Cel

-40 Cel

QUAD

40 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

Not Qualified

CY8C20647S-24LQXI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

1.71 V

85 Cel

M8C

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.6 mm

16384

6 mm

30

260

6 mm

2048

CMOS

4 mA

3.3 V

Microcontrollers

FLASH

.4 mm

S-XQCC-N48

3

Not Qualified

25.2 rpm

e4

CY8CTMA340-48LQI-09

Infineon Technologies

MICROPROCESSOR CIRCUIT

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.