MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
AGB75LC04-QU-E	Amulet Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V						FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.08 V	85 Cel		-40 Cel				QUAD		4.1 mm			28 mm						28 mm		CMOS		1.2 V					.5 mm		S-PQFP-G208	3
AR9331-AL1A	Qualcomm	MICROPROCESSOR CIRCUIT		NO LEAD	148	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V							BOTTOM		.9 mm			12 mm						12 mm		CMOS		1.2 V					.5 mm		S-PBCC-N148
AT97SC3205-U3A15-20	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			0	NO	8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25		85 Cel		-40 Cel	MATTE TIN	NO		DUAL	NO	1.1 mm			4.4 mm		0				9.7 mm		CMOS		3.3 V	NO		EEPROM	I2C	.65 mm		R-PDSO-G28			33 rpm	e3	6
ATTPM20P-G6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V	TS 16949					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	1.8 V	70 Cel		0 Cel				DUAL		.6 mm			2 mm						3 mm		CMOS						SPI	.5 mm		R-PDSO-N8
ATWINC3400-MR210CA131-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V						MICROELECTRONIC ASSEMBLY		2.5 V	85 Cel		-40 Cel				UNSPECIFIED		2.0874 mm			14.732 mm	SEATED HGT-CALCULATED			NOT SPECIFIED	NOT SPECIFIED	22.3774 mm		CMOS		3.6 V					1.204 mm		R-XXMA-N36
BT252KPJ20	Conexant Systems	MICROPROCESSOR CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V						CHIP CARRIER		4.75 V	70 Cel		0 Cel				QUAD		4.57 mm			16.5862 mm						16.5862 mm		CMOS		5 V					1.27 mm		S-PQCC-J44	1	Not Qualified
CC-WMX-L87C-TE	Digi International	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES							GRID ARRAY			85 Cel		-40 Cel				BOTTOM					50 mm						50 mm		CMOS							2 mm		S-XBGA-N400
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel		-40 Cel				BOTTOM		.8 mm			7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm		CMOS		1.8 V				I2C, QSPI, UART	.65 mm		S-PBGA-B84
CN5020-500BG564-SCP-G	Marvell Technology	MICROPROCESSOR CIRCUIT		BALL	564	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY									BOTTOM													CMOS									S-PBGA-B564
CSR8811A08-ICXR-R	Qualcomm	MICROPROCESSOR CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.8 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel		-30 Cel				BOTTOM		.6 mm			2.569 mm						3.208 mm		CMOS		3.3 V					.5 mm		R-PBGA-B28	1
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V						GRID ARRAY		3.135 V	85 Cel		0 Cel				BOTTOM		2.36 mm			23 mm				NOT SPECIFIED	NOT SPECIFIED	23 mm		CMOS		3.3 V					1 mm		S-PBGA-B419					14
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100					GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V				I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
GE209HISJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY									BOTTOM													CMOS									S-PBGA-B
GE210JIHJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY									BOTTOM													CMOS									S-PBGA-B
GE224PIXJ23JB	Advanced Micro Devices	MICROPROCESSOR CIRCUIT					UNSPECIFIED	UNSPECIFIED																														CMOS
GE412HIYJ44JB	Advanced Micro Devices	MICROPROCESSOR CIRCUIT					UNSPECIFIED	UNSPECIFIED																														CMOS
GE415GIBJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY									BOTTOM													CMOS									S-PBGA-B
GE420CIAJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY									BOTTOM													CMOS									S-PBGA-B
HSA2-040SCA/A2320A	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V								3.135 V	85 Cel		-40 Cel	MATTE TIN			DUAL										250			CMOS		3.3 V							R-PDSO-G28	1			e3
HSA2-040SCA/A2324TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V						SMALL OUTLINE		3.135 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL										250			CMOS		3.3 V							R-PDSO-G28	1			e3
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES							GRID ARRAY			110 Cel		-25 Cel				BOTTOM													CMOS									R-PBGA-B484
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		.8 mm			9 mm						9 mm		CMOS		3 V					.65 mm		S-PBGA-B144				e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V						GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel				BOTTOM		.8 mm			9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm		CMOS		1.8 V					.65 mm		S-PBGA-B144
RF430F5978IRGCR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				32	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm	32768		9 mm		0		30	260	9 mm	4096	CMOS	5.1 mA	3 V		Microcontrollers	FLASH	I2C; SPI; UART	.5 mm		S-PQCC-N64	3	Not Qualified	20 rpm	e4
SCH3106-NU	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V						FLATPACK, THIN PROFILE, FINE PITCH		2.97 V	70 Cel		0 Cel	MATTE TIN			QUAD		1.2 mm			14 mm						14 mm		CMOS		3.3 V					.4 mm		S-PQFP-G128				e3
SN74LS783N	Motorola	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V					5	IN-LINE	DIP40,.6	4.75 V	75 Cel		0 Cel	TIN LEAD			DUAL		5.08 mm			15.24 mm						52.07 mm		BIPOLAR	230 mA	5 V		Memory Controllers			2.54 mm		R-PDIP-T40		Not Qualified		e0
UCD3138ARJAR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel		-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES		QUAD		1 mm			6 mm				30	260	6 mm		CMOS		3.3 V					.5 mm		S-PQCC-N40	2			e4
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100				1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel		-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.5 mm			13 mm						13 mm		CMOS				Other uPs/uCs/Peripheral ICs			.8 mm		S-PBGA-B225	3	Not Qualified		e1
XCZU15EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V							R-PBGA-B1156	4			e1
XCZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	250			CMOS		.85 V							R-PBGA-B625	4			e1
XCZU6CG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V							R-PBGA-B900	4			e1
XCZU9EG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V						GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM									30	245			CMOS		.85 V							R-PBGA-B900	4			e1
XQ7Z100-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES							GRID ARRAY			100 Cel		-40 Cel				BOTTOM		3.44 mm			31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm		CMOS							1 mm		S-PBGA-B900
ZL30251LDG1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm	IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY					5 mm		CMOS		1.8 V					.5 mm		S-XQCC-N32
SN74ABT8996PWR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	4.5 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm			4.4 mm				30	260	7.8 mm		BICMOS		5 V		Other Microprocessor ICs			.65 mm		R-PDSO-G24	1	Not Qualified		e4
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100					GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.96 mm			23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V				CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V						GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		3.3 mm			19 mm				30	245	19 mm		CMOS		1.2 V					.8 mm		S-PBGA-B529	4			e1
SM32DM355GCEM216EP	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel		-55 Cel	TIN LEAD			BOTTOM		1.3 mm		8192	13 mm		32			260	13 mm		CMOS		1.3 V		Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0
SN54LVT8996FKR	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	J BEND	28	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	3.6 V						CHIP CARRIER		2.7 V	125 Cel		-55 Cel				QUAD													CMOS		3 V							S-CQCC-J28		Not Qualified
PAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V							BOTTOM		1.3 mm			13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V					.65 mm		S-PBGA-B361		Not Qualified
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V						GRID ARRAY, FINE PITCH		1.235 V	85 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		3.3 mm			19 mm				30	245	19 mm		CMOS		1.3 V					.8 mm		S-PBGA-B529	4			e1
XAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V							BOTTOM		1.4 mm			16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V					.8 mm		S-PBGA-B361		Not Qualified
SN74ALS6300DWR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V						SMALL OUTLINE		4.75 V	70 Cel		0 Cel				DUAL		2.65 mm			7.5 mm						15.4 mm		CMOS	185 mA	5 V					1.27 mm		R-PDSO-G24		Not Qualified
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100					GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm			15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V				CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TUSB2136PM	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD			QUAD		1.6 mm			10 mm				30	260	10 mm		CMOS	45 mA	3.3 V		Bus Controllers			.5 mm		S-PQFP-G64	3	Not Qualified		e4
CACT8997DWRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					5	SMALL OUTLINE	SOP28,.4	4.5 V	70 Cel		0 Cel	NICKEL PALLADIUM GOLD			DUAL		2.65 mm			7.5 mm				30	260	17.9 mm		CMOS		5 V		Other Microprocessor ICs			1.27 mm		R-PDSO-G28	1	Not Qualified		e4
SN54ACT8997FK	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	NO LEAD	28	QCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.5 V					5	CHIP CARRIER	LCC28,.45SQ	4.5 V	125 Cel		-55 Cel				QUAD		2.03 mm			11.43 mm				NOT SPECIFIED	NOT SPECIFIED	11.43 mm		CMOS	100 mA	5 V		Other Microprocessor ICs			1.27 mm		S-CQCC-N28		Not Qualified
TFB2002BM	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	FLAT	256	QFF	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES							FLATPACK			125 Cel		-55 Cel				QUAD													CMOS		5 V							S-CQFP-F256		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.