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| Manufacturer | Qualcomm |
|---|---|
| Manufacturer's Part Number | CSR8811A08-ICXR-R |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | CSR8811A08-ICXR-R Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Supply Voltage: | 4.8 V |
| Maximum Seated Height: | .6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 28 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 3.208 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 2.569 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 1 |









