MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

CYAT81688-100AA77

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

1.95 V

FLATPACK

1.71 V

85 Cel

-40 Cel

QUAD

IT ALSO OPERATES IN 3V TO 5.5V ANALOG SUPPLY

CMOS

S-PQFP-G100

CYPD3123-40LQXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

3

e4

CYTMA445-44LQI33ABA

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

NO LEAD

44

QCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER

QUAD

CMOS

S-XQCC-N44

E705204

Elo Touch Solutions

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

FLATPACK

70 Cel

0 Cel

QUAD

IT ALSO OPERATES AT 5V SUPPLY VOLTAGE

NOT SPECIFIED

NOT SPECIFIED

CMOS

3.3 V

S-PQFP-G64

FH82RM590ESRKLR

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

UNSPECIFIED

CMOS

R-XXXS-X

GLH110SR2CA

Intel

MICROPROCESSOR CIRCUIT

MTFC8GLCDM-1MWT

Micron Technology

MICROPROCESSOR CIRCUIT

OTHER

BALL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.65 V

85 Cel

-25 Cel

BOTTOM

1.2 mm

11.5 mm

IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

30

260

13 mm

CMOS

1.8 V

.5 mm

R-PBGA-B153

MV64360-B1-BAY1C133

Marvell Technology

MICROPROCESSOR CIRCUIT

CMOS

P8279-5

Rochester Electronics

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

70 Cel

0 Cel

DUAL

5.08 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

52.26 mm

CMOS

5 V

2.54 mm

R-PDIP-T40

RES3TV360

Intel

MICROPROCESSOR CIRCUIT

XA7Z010-1CLG400Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

AEC-Q100

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

125 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

N

BOTTOM

1.6 mm

17 mm

30

260

17 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B400

3

Not Qualified

e1

XAZU5EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

FBGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY, FINE PITCH

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.32 mm

23 mm

30

250

23 mm

CMOS

.72 V

.8 mm

S-PBGA-B784

4

e1

XCVC1902-2MSIVSVA2197

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2197

HBGA

SQUARE

PLASTIC/EPOXY

YES

.825 V

GRID ARRAY, HEAT SINK/SLUG

BGA2197,47X47,36

.775 V

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 mm

45 mm

45 mm

CMOS

.8 V

.92 mm

S-PBGA-B2197

e1

XCVP1502-1GSIVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

XCVP1502-3HSEVSVA2785

Xilinx

MICROPROCESSOR CIRCUIT

BALL

2785

HBGA

SQUARE

PLASTIC/EPOXY

YES

.906 V

GRID ARRAY, HEAT SINK/SLUG

BGA2785,53X53,36

.854 V

100 Cel

0 Cel

BOTTOM

4.48 mm

50 mm

50 mm

CMOS

.88 V

.92 mm

S-PBGA-B2785

XCZU19EG-1FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

XCZU2EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU2EG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

XCZU3EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

XCZU6EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU9CG-2FFVB1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-1FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU9EG-1FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XQ7Z020-1CL484I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

100 Cel

-40 Cel

TIN LEAD

N

BOTTOM

1.6 mm

19 mm

30

225

19 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B484

3

Not Qualified

e0

XQ7Z020-1CL484Q

Xilinx

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

BALL

484

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1,1.8

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA484,22X22,32

125 Cel

-40 Cel

TIN LEAD

N

BOTTOM

1.6 mm

19 mm

30

225

19 mm

CMOS

Other uPs/uCs/Peripheral ICs

.8 mm

S-PBGA-B484

3

Not Qualified

e0

1SX280HN1F43I1VGAS

Intel

MICROPROCESSOR CIRCUIT

1SX280LN3F43E2VGS2

Intel

MICROPROCESSOR CIRCUIT

BD82HM55SLGZS

Intel

MICROPROCESSOR CIRCUIT

UNSPECIFIED

1071

BGA

RECTANGULAR

UNSPECIFIED

YES

1.05,1.5,1.8,3.3,5

GRID ARRAY

BGA1071(UNSPEC)

UNSPECIFIED

CMOS

Bus Controllers

Not Qualified

CDP68HC68P1M

Renesas Electronics

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

8

5

SMALL OUTLINE

SOP16,.25

3 V

85 Cel

-55 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

240

9.9 mm

CMOS

3.3 V

Parallel IO Port

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

CY8C20347-24LQXI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

8

1.8/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

1.71 V

85 Cel

M8C

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.6 mm

16384

4 mm

30

260

4 mm

2048

CMOS

4 mA

3.3 V

Microcontrollers

FLASH

.5 mm

S-XQCC-N24

3

Not Qualified

25.2 rpm

e4

CY8CPLC20-28PVXI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

20

260

10.2 mm

CMOS

14 mA

5 V

Other Microprocessor ICs

.65 mm

R-PDSO-G28

3

Not Qualified

e3

CY8CTMA461-48LQI

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

NO LEAD

48

SQUARE

YES

5.5 V

1.71 V

QUAD

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

CMOS

S-XQCC-N48

CYTMA445-44LQI33ABAT

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

NO LEAD

44

QCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER

QUAD

CMOS

S-XQCC-N44

CYTMA525-49FNI25ZZT

Cypress Semiconductor

MICROPROCESSOR CIRCUIT

BALL

49

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY

1.71 V

BOTTOM

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

CMOS

R-PBGA-B49

DSL6540SLL44

Intel

MICROPROCESSOR CIRCUIT

EFR32ZG14P231F256GM32-B

Silicon Labs

MICROPROCESSOR CIRCUIT

Matte Tin (Sn)

260

2

e3

EM3581-RTR

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.32 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.18 V

85 Cel

-40 Cel

QUAD

.9 mm

7 mm

7 mm

CMOS

1.25 V

.5 mm

S-PQCC-N48

GL82CM238SR30U

Intel

MICROPROCESSOR CIRCUIT

SQUARE

UNSPECIFIED

CMOS

MTFC16GJGDQ-AITZ

Micron Technology

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MTFC64GJVDN-4MIT

Micron Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

169

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1.95 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

14 mm

IT ALSO OPERATES AT 3.3 VOLTS

18 mm

CMOS

1.8 V

.5 mm

R-PBGA-B169

e1

PSB83512MV12SLLVQ

Intel

MICROPROCESSOR CIRCUIT

PXB4369ELV21

Intel

MICROPROCESSOR CIRCUIT

PXB4387ELV21SLLF2

Intel

MICROPROCESSOR CIRCUIT

PXB4389ELV217SLLF6

Intel

MICROPROCESSOR CIRCUIT

SI3454-B01-IM

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

38

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

5 mm

40

260

7 mm

CMOS

3.3 V

.5 mm

R-XQCC-N38

3

e3

SI3459-B02-IM

Silicon Labs

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

QUAD

.9 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

CMOS

3.3 V

.5 mm

S-XQCC-N56

SI8250-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

SI8251-IQ

Silicon Labs

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

32

LQFP

SQUARE

PLASTIC/EPOXY

YES

2.75 V

FLATPACK, LOW PROFILE

2.25 V

125 Cel

-40 Cel

QUAD

1.6 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CMOS

2.5 V

.8 mm

S-PQFP-G32

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.