Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY, HEAT SINK/SLUG |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
32 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
I2C; SPI; UART |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
5 |
IN-LINE |
DIP24,.3 |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
NOT SPECIFIED |
NOT SPECIFIED |
32.005 mm |
BICMOS |
18 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
240 |
FQFP |
SQUARE |
METAL |
YES |
5.25 V |
FLATPACK, FINE PITCH |
4.75 V |
85 Cel |
-20 Cel |
QUAD |
4.2 mm |
31.64 mm |
31.64 mm |
CMOS |
5 V |
.5 mm |
S-MQFP-G240 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, SHRINK PITCH |
4.5 V |
70 Cel |
0 Cel |
DUAL |
2.05 mm |
5.3 mm |
7.2 mm |
CMOS |
5 V |
.65 mm |
R-PDSO-G20 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
8 |
30 |
260 |
15.4 mm |
CMOS |
7 mA |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
2.6 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
CMOS |
1.1 mA |
3 V |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
8 |
30 |
260 |
15.4 mm |
BICMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
684 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.47 V |
GRID ARRAY, HEAT SINK/SLUG |
3.14 V |
TIN SILVER COPPER |
BOTTOM |
3.06 mm |
23 mm |
IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY |
30 |
250 |
23 mm |
CMOS |
3.3 V |
.8 mm |
S-PBGA-B684 |
4 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.4 mm |
16 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
16 mm |
CMOS |
1.3 V |
.8 mm |
S-PBGA-B361 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
4.5 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
4.4 mm |
0 |
30 |
260 |
7.8 mm |
BICMOS |
5 V |
Other Microprocessor ICs |
.65 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA64,8X8,32 |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
8 mm |
0 |
30 |
260 |
8 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B64 |
3 |
Not Qualified |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
126 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4.8 V |
GRID ARRAY |
2.7 V |
70 Cel |
-20 Cel |
BOTTOM |
CMOS |
S-PBGA-B126 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
CHIP CARRIER |
2.7 V |
125 Cel |
-55 Cel |
QUAD |
CMOS |
3.3 V |
S-CQCC-J28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
BALL |
337 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.365 V |
32 |
1.3,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA337,19X19,25 |
1.235 V |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
1.3 mm |
8192 |
13 mm |
32 |
260 |
13 mm |
CMOS |
1.3 V |
Digital Signal Processors |
I2C; SPI; UART; USB |
.65 mm |
FIXED POINT |
S-PBGA-B337 |
3 |
e0 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
3 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
100 mA |
3.3 V |
Bus Controllers |
.5 mm |
S-PQFP-G48 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
8.9662 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.9662 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J20 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
BGA167,22X22,26 |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
32 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
I2C(2), SPI(4), UART(3), |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
161 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.14 V |
125 Cel |
-40 Cel |
BOTTOM |
1.17 mm |
10.4 mm |
10.4 mm |
CMOS |
1.2 V |
.65 mm |
S-PBGA-B161 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
10 mm |
0 |
30 |
260 |
10 mm |
BICMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
23 mm |
30 |
250 |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 Class Q |
5 |
IN-LINE |
DIP24,.3 |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
32.005 mm |
BICMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T24 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
48 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
CAN; I2C; SPI; UART |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
70 Cel |
0 Cel |
DUAL |
1.2 mm |
3 mm |
CAN ALSO OPERATE AT 5V SUPPLY |
4.4 mm |
CMOS |
3 V |
.65 mm |
R-PDSO-G8 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.28 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
13 mm |
30 |
260 |
13 mm |
CMOS |
1.2 V |
.65 mm |
S-PBGA-B338 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
529 |
HFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
BGA529,23X23,32 |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
3.1 mm |
32768 |
19 mm |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B529 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
1.8 V |
70 Cel |
-20 Cel |
UNSPECIFIED |
2 mm |
13.5 mm |
SEATED HGT-NOM |
16.3 mm |
CMOS |
2.7 V |
R-XXMA-N46 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
85 Cel |
-40 Cel |
DUAL |
5 V |
Other Microprocessor ICs |
.635 mm |
R-PDSO-G24 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2.65 mm |
7.5 mm |
8 |
NOT SPECIFIED |
260 |
15.4 mm |
CMOS |
7 mA |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
FLAT |
100 |
QFF |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
2.7 mm |
14 mm |
20 mm |
CMOS |
5 V |
.65 mm |
R-GQFP-F100 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
8 |
30 |
260 |
15.4 mm |
BICMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
0 |
30 |
260 |
7 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; UART; USART |
.5 mm |
S-PQCC-N48 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-STD-883 |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
0 |
CMOS |
5 V |
R-GDIP-T28 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
23 mm |
48 |
32 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; I2C; PCI; SPI; UART; USB |
.8 mm |
S-PBGA-B760 |
3 |
1000 rpm |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
3.3 |
IN-LINE |
DIP28,.6 |
3 V |
70 Cel |
0 Cel |
DUAL |
5.08 mm |
15.24 mm |
NOT SPECIFIED |
NOT SPECIFIED |
36.32 mm |
CMOS |
100 mA |
3.3 V |
Bus Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
38535Q/M;38534H;883B |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
-55 Cel |
PERPENDICULAR |
NOT SPECIFIED |
NOT SPECIFIED |
NMOS |
5 V |
Display Controllers |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
LVT |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
8 |
30 |
260 |
15.4 mm |
CMOS |
7 mA |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
1 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
DUAL |
5.08 mm |
7.62 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
CMOS |
185 mA |
5 V |
2.54 mm |
R-PDIP-T16 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.98 V |
16 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
1.62 V |
85 Cel |
CR16C |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
10 mm |
30 |
260 |
10 mm |
32768 |
CMOS |
200 mA |
1.8 V |
Microcontrollers |
.8 mm |
S-PBGA-B144 |
3 |
Not Qualified |
96 rpm |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
3.6 |
MICROELECTRONIC ASSEMBLY |
LGA46(UNSPEC) |
1.8 V |
70 Cel |
-20 Cel |
UNSPECIFIED |
2 mm |
13.5 mm |
SEATED HGT-NOM |
16.3 mm |
CMOS |
275 mA |
2.7 V |
Serial IO/Communication Controllers |
R-XXMA-N46 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY, HEAT SINK/SLUG |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
32 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
I2C; SPI; UART |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
CMOS |
5 V |
S-CQCC-N28 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
48 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
CAN; I2C; SPI; UART |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
TIN SILVER COPPER |
30 |
245 |
4 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
6.1 mm |
30 |
260 |
17 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-G64 |
1 |
Not Qualified |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16384 |
16 mm |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
2.96 mm |
23 mm |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.