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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | DM8147BCIS0 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: 3.14 V; |
Datasheet | DM8147BCIS0 Datasheet |
In Stock | 3,321 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.14 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Supply Voltage: | 3.47 V |
Maximum Seated Height: | 3.06 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 684 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Length: | 23 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B684 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Additional Features: | IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY |
Peak Reflow Temperature (C): | 250 |
Package Code: | HBGA |
Width: | 23 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 4 |