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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCZU7EV-L2FFVC1156E |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR; |
| Datasheet | XCZU7EV-L2FFVC1156E Datasheet |
| In Stock | 1,337 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .698 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .72 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Supply Voltage: | .742 V |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 1156 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B1156 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Additional Features: | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
| Maximum Operating Temperature: | 110 Cel |
| Peak Reflow Temperature (C): | 245 |
| Package Code: | BGA |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 4 |









