Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
4.57 mm |
11.43 mm |
245 |
11.43 mm |
CMOS |
5 V |
Parallel IO Port |
1.27 mm |
S-PQCC-J28 |
2A |
Not Qualified |
e0 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
MIL-PRF-38535 |
5 |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
3.62 mm |
24.38 mm |
16 |
24.38 mm |
CMOS |
.45 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
e0 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 Class Q |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
NOT SPECIFIED |
NOT SPECIFIED |
BICMOS |
5 V |
R-GDIP-T24 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
367 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.11 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
BGA167,22X22,26 |
1.02 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.82 mm |
15 mm |
32 |
32 MHz |
30 |
250 |
15 mm |
CMOS |
1.06 V |
I2C(2), SPI(4), UART(3), |
.65 mm |
S-PBGA-B367 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
GULL WING |
240 |
FQFP |
SQUARE |
METAL |
YES |
5.25 V |
FLATPACK, FINE PITCH |
4.75 V |
85 Cel |
-20 Cel |
QUAD |
4.2 mm |
31.64 mm |
31.64 mm |
CMOS |
5 V |
.5 mm |
S-MQFP-G240 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
316 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16 mm |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B316 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
68 |
QFF |
SQUARE |
CERAMIC, GLASS-SEALED |
YES |
5.5 V |
MIL-STD-883 |
FLATPACK |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
5 V |
S-GQFP-F68 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G48 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
SMALL OUTLINE |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
2.65 mm |
7.5 mm |
15.4 mm |
CMOS |
7 mA |
3.3 V |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA361,19X19,32 |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.4 mm |
16384 |
16 mm |
DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY |
16 mm |
CMOS |
1.2 V |
Digital Signal Processors |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
PIN/PEG |
68 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
MIL-STD-883 |
5 |
GRID ARRAY |
PGA68,11X11 |
4.5 V |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
3.62 mm |
24.38 mm |
16 |
24.38 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
S-CPGA-P68 |
Not Qualified |
e0 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.3 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
2.7 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.2 mm |
3 mm |
CAN ALSO OPERATE AT 5V SUPPLY |
30 |
260 |
4.4 mm |
CMOS |
3 V |
Serial IO/Communication Controllers |
UART |
.65 mm |
R-PDSO-G8 |
1 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
2.96 mm |
23 mm |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
23 mm |
64 |
32 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; I2C; SPI; UART; USB |
.8 mm |
S-PBGA-B760 |
3 |
1176 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
CMOS |
.45 mA |
5 V |
S-PQCC-J44 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
QUAD |
1.2 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G100 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
GULL WING |
100 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
3 V |
QUAD |
1.2 mm |
14 mm |
14 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G100 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
R-PQFP-G100 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
MIL-STD-883 |
3/3.3 |
SMALL OUTLINE |
SOP24,.4 |
2.7 V |
85 Cel |
-40 Cel |
GOLD FLASH PALLADIUM |
DUAL |
2.65 mm |
7.49 mm |
15.365 mm |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G24 |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
CHIP CARRIER |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
19.13 mm |
19.13 mm |
CMOS |
5 V |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
28 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
MIL-PRF-38535 Class Q |
5 |
CHIP CARRIER |
LCC28,.45SQ |
4.5 V |
125 Cel |
ACT |
-55 Cel |
TIN LEAD |
QUAD |
2.03 mm |
11.43 mm |
0 |
11.43 mm |
CMOS |
.1 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-CQCC-N28 |
Qualified |
e0 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
529 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
30 |
245 |
19 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B529 |
4 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
0 |
30 |
260 |
6 mm |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
SPI; UART |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
70 Cel |
0 Cel |
DUAL |
2.65 mm |
7.5 mm |
17.9 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
100 |
QFF |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
FLATPACK |
125 Cel |
-55 Cel |
QUAD |
CMOS |
5 V |
R-CQFP-F100 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
30 |
260 |
16 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B361 |
3 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
529 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.3 mm |
19 mm |
30 |
245 |
19 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B529 |
4 |
e1 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
161 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.32 V |
AEC-Q100 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.14 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.2 mm |
10.4 mm |
30 |
260 |
10.4 mm |
589824 |
CMOS |
1.2 V |
.65 mm |
S-PBGA-B161 |
3 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.75 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
16.585 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16.585 mm |
CMOS |
.7 mA |
5 V |
Bus Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
FLAT |
24 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
3.6 V |
MIL-PRF-38535 |
3/3.3 |
FLATPACK |
FL24,.35 |
2.7 V |
125 Cel |
-55 Cel |
DUAL |
2.29 mm |
9.09 mm |
14.36 mm |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
R-GDFP-F |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
MIL-PRF-38535 Class Q |
IN-LINE |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
0 |
NOT SPECIFIED |
NOT SPECIFIED |
36.83 mm |
CMOS |
5 V |
2.54 mm |
R-GDIP-T28 |
Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
529 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, HEAT SINK/SLUG |
1.14 V |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.3 mm |
19 mm |
NOT SPECIFIED |
245 |
19 mm |
CMOS |
1.2 V |
.8 mm |
S-PBGA-B529 |
4 |
e1 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
FLATPACK |
4.75 V |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
S-PQFP-G208 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
J BEND |
28 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
3/3.3 |
CHIP CARRIER |
LCC28,.45SQ |
2.7 V |
125 Cel |
-55 Cel |
QUAD |
CMOS |
3 V |
Other Microprocessor ICs |
1.27 mm |
S-CQCC-J28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
2.96 mm |
23 mm |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
5 |
IN-LINE |
DIP28,.6 |
4.5 V |
125 Cel |
-55 Cel |
DUAL |
5.08 mm |
7.62 mm |
NOT SPECIFIED |
NOT SPECIFIED |
36.83 mm |
CMOS |
100 mA |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-GDIP-T28 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.9 mm |
5 mm |
30 |
260 |
5 mm |
CMOS |
3 V |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
3 |
Not Qualified |
e4 |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
MILITARY |
NO LEAD |
20 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
CHIP CARRIER |
4.5 V |
125 Cel |
-55 Cel |
QUAD |
2.03 mm |
8.89 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8.89 mm |
CMOS |
5 V |
1.27 mm |
S-CQCC-N20 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.96 mm |
23 mm |
64 |
32 MHz |
30 |
250 |
23 mm |
CMOS |
1.15 V |
CAN; I2C; PCI; SPI; UART; USB |
.8 mm |
S-PBGA-B760 |
3 |
1000 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
BOTTOM |
1.3 mm |
13 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
13 mm |
CMOS |
1.3 V |
.65 mm |
S-PBGA-B361 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
BALL |
760 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2 V |
AEC-Q100 |
GRID ARRAY, FINE PITCH |
1.11 V |
125 Cel |
-40 Cel |
BOTTOM |
2.96 mm |
23 mm |
23 mm |
CMOS |
1.15 V |
.8 mm |
S-PBGA-B760 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
85 Cel |
-40 Cel |
QUAD |
4.57 mm |
11.5062 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11.5062 mm |
CMOS |
200 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
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Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
0 Cel |
BOTTOM |
1.3 mm |
13 mm |
13 mm |
CMOS |
1.2 V |
.65 mm |
S-PBGA-B338 |
Not Qualified |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.