Texas Instruments - SN54ACT8997JT

OMAPL138EZWTA3E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It is ideal for industrial applications requiring I2C, SPI, UART, and USB bus compatibility. This low-profile IC operates b/w -40 to 105 °C with a supply voltage range of 1.25V to 1.35V.

MCP2221-I/ML by Microchip Technology is a CMOS peripheral IC with 16 terminals and a max supply voltage of 5.5V. It operates in industrial temperatures (-40 to 85 °C) and has a terminal pitch of 0.65mm. This chip carrier is suitable for microprocessor circuits, offering power supplies at 3.3/5V for various applications.

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

MCIMX6Q6AVT10ACR by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.35V to 1.5V and uses BALL terminal form for automotive applications.

XC7Z020-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05 V. This low profile, fine pitch chip in a grid array package is ideal for various applications requiring high performance and integration.

PSoC;

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

ESP32-C3FN4 by Espressif Systems (shanghai) Operates at 3.6V, -40 to 85°C temp range, CMOS tech. Ideal for microprocessor circuits in IoT devices due to its small size (5x5mm), low power consumption, and quad terminal position.

SoC;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

XC7Z010-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.

XC7Z007S-1CLG225C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

CC1310F128RSMT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85°C, with a supply voltage range of 1.8-3.8V. Ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.

OMAPL138EZWTA3 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 105 °C, making it suitable for applications requiring high-speed processing in harsh environments. With I2C, SPI, UART, and USB bus compatibility, this device is ideal for various embedded systems and industrial automation solutions.

MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

SLB9670XQ20FW762XUMA1 by Infineon Technologies is a cryptographic authenticator with CMOS technology. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max supply voltage of 1.95V, it is suitable for industrial applications requiring secure authentication.

SoC;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;