NXP Semiconductors - MCIMX6S7CVM08AB

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MCIMX6S7CVM08AB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6S7CVM08AB
Description SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX6S7CVM08AB Datasheet
In Stock3,832
NAME DESCRIPTION
Minimum Supply Voltage: 1.275 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 624
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 21 mm
Additional Features: 24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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