MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	No. of Ports	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
ATTPM20P-H6MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES		TS 16949						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		85 Cel		-40 Cel			DUAL			.6 mm			2 mm								3 mm		CMOS			3.3 V					SPI	.5 mm		R-PDSO-N8
ATWINC1500-MR210UB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED			2.113 mm			14.73 mm								21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210PB1944	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED			2.113 mm			14.73 mm								21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED			2.113 mm			14.73 mm								21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC1510-MR210PB1963	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED			2.113 mm			14.73 mm		SEATED HGT-NOM						21.72 mm		CMOS			3.6 V								R-XXMA-N28
ATWINC1510-MR210PB1963-T	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel			UNSPECIFIED																CMOS			3.3 V					I2C, SPI			R-XXMA-N28
ATWINC1510-MR210PB1976	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED			2.113 mm			14.73 mm								21.72 mm		CMOS			3.3 V								R-XXMA-N28
ATWINC3400-MR210UA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	4.2 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel			UNSPECIFIED			2.087 mm			14.732 mm		SEATED HGT-CALCULATED				NOT SPECIFIED	NOT SPECIFIED	22.428 mm		CMOS			3.6 V						1.204 mm		R-XXMA-N36
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100						GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.17 mm			10.4 mm						30	260	10.4 mm	1572864	CMOS			1.2 V						.65 mm		S-PBGA-B161	3			e1
CP2130-F01-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel		-40 Cel			QUAD			.8 mm			4 mm						NOT SPECIFIED	NOT SPECIFIED	4 mm		CMOS			3.3 V						.5 mm		S-XQCC-N24
CYPD3125-40LQXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.7 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD			.6 mm			6 mm								6 mm		CMOS			3.3 V						.5 mm		S-XQCC-N40	3			e4
CYUSB3017-BZXC	Infineon Technologies	MICROPROCESSOR CIRCUIT																					TIN SILVER COPPER																														3			e1
D2-74083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V							FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-10 Cel	MATTE TIN		QUAD			1.6 mm			14 mm						30	260	14 mm		CMOS			1.8 V						.4 mm		S-PQFP-G128	3			e3
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
DS2465P+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V							SMALL OUTLINE		2.97 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed		DUAL			1.5 mm			3.76 mm						30	260	3.94 mm		CMOS			3.3 V						1.27 mm		R-PDSO-C6	1			e3
FT245BM	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V							FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	TIN LEAD		QUAD			1.6 mm			7 mm							250	7 mm		CMOS			5 V						.8 mm		S-PQFP-G32	3	Not Qualified		e0
IP2022/PQ80-120U	Qualcomm	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	2.7 V							FLATPACK		2.3 V	85 Cel		-40 Cel			QUAD			3.4 mm			14 mm						NOT SPECIFIED	NOT SPECIFIED	20 mm		CMOS			2.5 V						.8 mm		R-PQFP-G80
JN5169-001-M06-2Z	NXP Semiconductors	MICROPROCESSOR CIRCUIT																																				240															3
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V						.4 mm		S-PBGA-B25	1			e1		20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel		-30 Cel	TIN SILVER COPPER		BOTTOM		20	.675 mm			2.01 mm						30	260	2.01 mm		CMOS		.03 mA	1.8 V						.4 mm		S-PBGA-B25	1			e1		20
LTC4263IDE	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE, VERY THIN PROFILE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		DUAL			.8 mm			3 mm								4 mm		CMOS			5 V						.5 mm		R-PDSO-N14	1	Not Qualified		e0
LTC4263IS	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)		DUAL			1.752 mm			3.9 mm								8.649 mm		CMOS			5 V						1.27 mm		R-PDSO-G14	1	Not Qualified		e0
LTC4263IS#TR	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	TIN LEAD		DUAL			1.752 mm			3.9 mm								8.649 mm		CMOS			5 V						1.27 mm		R-PDSO-G14	1	Not Qualified		e0
MCP25025-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL			1.75 mm			3.9 mm								8.65 mm		CMOS			5 V		Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MCP25025T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)		DUAL			1.75 mm			3.9 mm								8.65 mm		CMOS			5 V		Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified		e3
MSP430F6747AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES		1.6 mm	262144	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm	e4	8	62
MSP430F6767IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	262144	32	14 mm				0	25 MHz	30	260	14 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm	e4
MSP430F67791IPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V					16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	1.8 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD			1.6 mm	524288	32	14 mm				0		30	260	20 mm	32768	CMOS		11.75 mA	3.3 V		Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3	Not Qualified	25 rpm	e4
MTCH6102-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	TS 16949						SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	MATTE TIN		DUAL			2 mm			5.3 mm						40	260	10.2 mm		CMOS			3 V						.65 mm		R-PDSO-G28	2			e3
MTFC64GJDDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			14 mm		IT ALSO OPERATES AT 3.3 VOLTS						18 mm		CMOS			1.8 V						.5 mm		R-PBGA-B169				e1
MTFC8GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, LOW PROFILE		2.7 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM			1.4 mm			14 mm						30	260	18 mm		CMOS			3.3 V						1 mm		R-PBGA-B100				e1
OMAPL138BZWTRB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm		IT ASLO OPERATES IN 0.95V MINIMUM SUPPLY				30	260	16 mm		CMOS			1.3 V						.8 mm		S-PBGA-B361	3			e1
OMAPL138CZWTA3RW	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES								MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel			UNSPECIFIED			1.525 mm			3.81 mm		SEATED HGT-NOM				30	260	5.59 mm		CMOS			1.25 V								R-XXMA-N25	3
ST33GTPMII2C	STMicroelectronics	MICROPROCESSOR CIRCUIT
TDA8035HN/C1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V						3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel		-25 Cel			QUAD			1 mm			5 mm							260	5 mm		CMOS		220 mA	3.3 V		Other Microprocessor ICs				.5 mm		S-PQCC-N32	1	Not Qualified
TMS320DM355DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V					32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm		8192	13 mm		IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O		32		30	260	13 mm		CMOS			1.3 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES						32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM			1.3 mm		32768	13 mm				32		30	260	13 mm		CMOS					Digital Signal Processors			ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM6446AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V					32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm		16384	16 mm		DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		48		30	260	16 mm		CMOS			1.2 V		Digital Signal Processors			I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMSDM6446AZWT-COM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
TNETV6446AINZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm						30	260	16 mm		CMOS			1.2 V						.8 mm		S-PBGA-B361	3			e1
UCD3138A64PFCR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V				NO			FLATPACK, THIN PROFILE, FINE PITCH		3 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	NO		1.2 mm	65536		12 mm	2K		COMPARATOR(7)	0	2 MHz	30	260	12 mm		CMOS			3.3 V	NO				I2C; SPI; UART	.5 mm		S-PQFP-G80	3			e4	8	43
XCZU11EG-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V								R-PBGA-B1517	4			e1
XCZU11EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V							GRID ARRAY		.698 V	110 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM								ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY				30	245			CMOS			.72 V								R-PBGA-B1760	4			e1
XCZU19EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245			CMOS			.85 V								R-PBGA-B1517	4			e1
XCZU1CG-2UBVA494I	Xilinx	MICROPROCESSOR CIRCUIT																					TIN SILVER BISMUTH COPPER NICKEL														30	245															4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.