Texas Instruments - TMSDM6467TCUT1TAN

TMSDM6467TCUT1TAN by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TMSDM6467TCUT1TAN
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
Datasheet TMSDM6467TCUT1TAN Datasheet
In Stock3,004
NAME DESCRIPTION
Minimum Supply Voltage: 1.235 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.3 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 529
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B529
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.365 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 19 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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