Advanced Micro Devices - GE209HISJ23HM

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GE209HISJ23HM by Advanced Micro Devices

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Manufacturer Advanced Micro Devices
Manufacturer's Part Number GE209HISJ23HM
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; Surface Mount: YES;
Datasheet GE209HISJ23HM Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Surface Mount: YES
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