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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XQ7Z045-1RF676I |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.8; |
| Datasheet | XQ7Z045-1RF676I Datasheet |
| In Stock | 932 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Ultraviolet Erasable: | N |
| Maximum Seated Height: | 3.37 mm |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN LEAD |
| JESD-609 Code: | e0 |
| No. of Terminals: | 676 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA676,26X26,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 27 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B676 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 27 mm |
| Terminal Pitch: | 1 mm |
| Power Supplies (V): | 1,1.8 |









