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Manufacturer | Xilinx |
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Manufacturer's Part Number | XAZU2EG-1SFVA625I |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | XAZU2EG-1SFVA625I Datasheet |
In Stock | 87 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .85 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.43 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 625 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Length: | 21 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B625 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Peak Reflow Temperature (C): | 250 |
Package Code: | FBGA |
Width: | 21 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Moisture Sensitivity Level (MSL): | 3 |