Xilinx - XQ7Z045-1RFG676Q

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XQ7Z045-1RFG676Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z045-1RFG676Q
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ7Z045-1RFG676Q Datasheet
In Stock261
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 3.37 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 676
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 27 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B676
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: BGA
Width: 27 mm
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
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