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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU9EG-2FFVB1156E |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR; |
Datasheet | XCZU9EG-2FFVB1156E Datasheet |
In Stock | 10 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .825 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .85 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.42 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 1156 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B1156 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Package Code: | BGA |
Width: | 35 mm |
Moisture Sensitivity Level (MSL): | 4 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | .876 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Length: | 35 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | 1 mm |
Temperature Grade: | OTHER |