Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
250 |
CMOS |
.72 V |
R-PBGA-B784 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
12 V |
IN-LINE |
4.5 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5.08 mm |
7.62 mm |
VCCB(Min)(V) is 3, VCCB(Max)(V) is 12 |
0 |
.4 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
9.81 mm |
BIPOLAR |
5 V |
I2C |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.35 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.25 V |
90 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.4 mm |
16 mm |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY |
32 |
50 MHz |
30 |
260 |
16 mm |
CMOS |
1.3 V |
I2C; SPI; UART; USB |
.8 mm |
S-PBGA-B361 |
3 |
456 rpm |
e1 |
||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
3.51 mm |
35 mm |
30 |
245 |
35 mm |
CMOS |
.85 V |
1 mm |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
S-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
7 mm |
DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF |
30 |
260 |
7 mm |
81920 |
CMOS |
3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
30 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
4 mm |
NOT SPECIFIED |
260 |
4 mm |
28672 |
CMOS |
3.3 V |
.4 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BUTT |
63 |
BCC |
RECTANGULAR |
UNSPECIFIED |
NO |
YES |
3.6 V |
8 |
0 |
NO |
CHIP CARRIER |
2.3 V |
85 Cel |
CORTEX-M4 |
0 |
-40 Cel |
NICKEL GOLD |
YES |
BOTTOM |
NO |
2.45 mm |
1024000 |
256 |
17.5 mm |
0 |
YES |
TIMER(4), WDT |
0 |
30 |
260 |
20.5 mm |
4 |
262144 |
CMOS |
4-Ch 12-Bit |
3.3 V |
2 |
NO |
2 |
I2C, I2S, SD, SPI, UART |
FLASH |
1.27 mm |
FIXED POINT |
R-XBCC-B63 |
3 |
2400 rpm |
YES |
e4 |
8 |
25 |
||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.742 V |
GRID ARRAY |
.698 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
30 |
245 |
CMOS |
.72 V |
R-PBGA-B1156 |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.42 V |
32 |
1.35,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA338,19X19,25 |
1.28 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
8192 |
13 mm |
32 |
30 |
260 |
13 mm |
CMOS |
1.35 V |
Digital Signal Processors |
I2C; SPI; UART; USB |
.65 mm |
FIXED POINT |
S-PBGA-B338 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
12 mm |
30 |
260 |
12 mm |
CMOS |
3.3 V |
.5 mm |
S-PQFP-G80 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
3 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1.2 mm |
14 mm |
0 |
NOT SPECIFIED |
260 |
14 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B484 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.42 V |
32 |
1.35,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA338,19X19,25 |
1.28 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
8192 |
13 mm |
32 |
30 |
260 |
13 mm |
CMOS |
1.35 V |
Digital Signal Processors |
I2C; SPI; UART; USB |
.65 mm |
FIXED POINT |
S-PBGA-B338 |
3 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B484 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
NO LEAD |
28 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
TS 16949 |
3.3 |
CHIP CARRIER |
LCC64,.30SQ,16 |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.9 mm |
7.5 mm |
7.5 mm |
275 mA |
3.3 V |
Bus Controllers |
.4 mm |
S-PQCC-N64 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
20 |
260 |
10.2 mm |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
10 mm |
0 |
30 |
260 |
10 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B100 |
4 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
20 |
260 |
10.2 mm |
CMOS |
5 V |
Other uPs/uCs/Peripheral ICs |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.927 V |
GRID ARRAY |
.873 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.9 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
NOT SPECIFIED |
260 |
5 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
1 mm |
5 mm |
30 |
260 |
7 mm |
CMOS |
3 V |
.5 mm |
R-XQCC-N40 |
1 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
4.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.752 mm |
3.899 mm |
30 |
260 |
8.649 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G14 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1156 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1156 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
4.2 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
SEATED HGT-NOM |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.6 V |
R-XXMA-N28 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
3 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
1.5 mm |
10 mm |
0 |
NOT SPECIFIED |
235 |
10 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PBGA-B100 |
3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
1517 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1517 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
1760 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B1760 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
OTHER |
BALL |
338 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.42 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.28 V |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.3 mm |
13 mm |
30 |
260 |
13 mm |
CMOS |
1.35 V |
.65 mm |
S-PBGA-B338 |
3 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
900 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
245 |
CMOS |
.85 V |
R-PBGA-B900 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
784 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
.876 V |
GRID ARRAY |
.825 V |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
30 |
250 |
CMOS |
.85 V |
R-PBGA-B784 |
4 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Qualcomm |
MICROPROCESSOR CIRCUIT |
BALL |
112 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
S-PBGA-B112 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
1.6 mm |
7 mm |
7 mm |
CMOS |
325 mA |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
6 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.7 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
7 mm |
30 |
260 |
7 mm |
CMOS |
325 mA |
3.3 V |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G48 |
1 |
Not Qualified |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.