MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

XCZU7EV-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU4EV-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

250

CMOS

.72 V

R-PBGA-B784

4

e1

P82B715P

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

12 V

IN-LINE

4.5 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

5.08 mm

7.62 mm

VCCB(Min)(V) is 3, VCCB(Max)(V) is 12

0

.4 MHz

NOT SPECIFIED

NOT SPECIFIED

9.81 mm

BIPOLAR

5 V

I2C

2.54 mm

R-PDIP-T8

Not Qualified

e4

OMAPL138EZWTD4

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

32

50 MHz

30

260

16 mm

CMOS

1.3 V

I2C; SPI; UART; USB

.8 mm

S-PBGA-B361

3

456 rpm

e1

XCZU7EV-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.51 mm

35 mm

30

245

35 mm

CMOS

.85 V

1 mm

R-PBGA-B1156

4

e1

XCZU4CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

S-PBGA-B784

4

e1

XCZU7EV-2FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

STSPIN32F0B

STMicroelectronics

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC1312R1F3RGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

7 mm

DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

30

260

7 mm

81920

CMOS

3 V

.5 mm

S-PQCC-N48

3

e4

30

XCZU4CG-1FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

ATWINC1500-MR210PB1172

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

3.6 V

MICROELECTRONIC ASSEMBLY

2.7 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

21.72 mm

CMOS

3.3 V

R-XXMA-N28

CC1310F64RSMR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

4 mm

NOT SPECIFIED

260

4 mm

28672

CMOS

3.3 V

.4 mm

S-PQCC-N32

3

e4

ATWINC1500-MR210PB1961-T

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

21.72 mm

CMOS

3.6 V

R-XXMA-N28

XCZU7EV-1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

XCZU7EV-2FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

ATWINC1500-MR210PB

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

21.72 mm

CMOS

3.6 V

R-XXMA-N28

CC3220MODSF12MOBR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BUTT

63

BCC

RECTANGULAR

UNSPECIFIED

NO

YES

3.6 V

8

0

NO

CHIP CARRIER

2.3 V

85 Cel

CORTEX-M4

0

-40 Cel

NICKEL GOLD

YES

BOTTOM

NO

2.45 mm

1024000

256

17.5 mm

0

YES

TIMER(4), WDT

0

30

260

20.5 mm

4

262144

CMOS

4-Ch 12-Bit

3.3 V

2

NO

2

I2C, I2S, SD, SPI, UART

FLASH

1.27 mm

FIXED POINT

R-XBCC-B63

3

2400 rpm

YES

e4

8

25

XCZU7EV-L1FFVC1156I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.742 V

GRID ARRAY

.698 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

30

245

CMOS

.72 V

R-PBGA-B1156

4

e1

TMS320DM365ZCED30

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

TMS320F28PLC84PNT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

FLATPACK, LOW PROFILE, FINE PITCH

2.97 V

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1.6 mm

12 mm

30

260

12 mm

CMOS

3.3 V

.5 mm

S-PQFP-G80

3

e4

SCANSTA112VSX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

3 V

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1.2 mm

14 mm

0

NOT SPECIFIED

260

14 mm

CMOS

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G100

3

Not Qualified

e4

XCZU2CG-1SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B484

4

e1

TMS320DM368ZCEF

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

XCZU3CG-1SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

484

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B484

4

e1

ATWINC1500-MR210PB1976

Microchip Technology

MICROPROCESSOR CIRCUIT

NO LEAD

28

XMA

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

21.72 mm

CMOS

3.3 V

R-XXMA-N28

XCZU19EG-2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

CC1310F32RGZT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

7 mm

NOT SPECIFIED

260

7 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N48

3

e4

USB2660I-JZX-03-TR

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

64

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

TS 16949

3.3

CHIP CARRIER

LCC64,.30SQ,16

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.9 mm

7.5 mm

7.5 mm

275 mA

3.3 V

Bus Controllers

.4 mm

S-PQCC-N64

Not Qualified

e3

CY8CPLC10-28PVXIT

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

20

260

10.2 mm

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.65 mm

R-PDSO-G28

3

Not Qualified

e3

SCANSTA112SMX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA100,10X10,32

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

10 mm

0

30

260

10 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B100

4

Not Qualified

e1

XCZU3EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

CY8CPLC10-28PVXI

Infineon Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP28,.3

4.75 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2 mm

5.3 mm

20

260

10.2 mm

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.65 mm

R-PDSO-G28

3

Not Qualified

e3

XCZU7EV-3FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.927 V

GRID ARRAY

.873 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.9 V

R-PBGA-B900

4

e1

CC1310F64RHBT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

CORTEX-M3

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1 mm

5 mm

NOT SPECIFIED

260

5 mm

28672

CMOS

3.3 V

.5 mm

S-PQCC-N32

3

e4

ZL30250LDG1

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1.89 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

1.71 V

85 Cel

-40 Cel

QUAD

1 mm

5 mm

IT ALSO OPERATES AT 3.3V NOMINAL SUPPLY

5 mm

CMOS

1.8 V

.5 mm

S-XQCC-N32

AX-SFUS-1-01-TB05

Onsemi

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8 V

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

1 mm

5 mm

30

260

7 mm

CMOS

3 V

.5 mm

R-XQCC-N40

1

LTC4263IS#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

XCZU11EG-1FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1156

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1156

4

e1

ATWINC1500-MR210PB1140

Microchip Technology

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

4.2 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

2.113 mm

14.73 mm

SEATED HGT-NOM

NOT SPECIFIED

NOT SPECIFIED

21.72 mm

CMOS

3.6 V

R-XXMA-N28

SCANSTA112SMX

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA100,10X10,32

3 V

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

1.5 mm

10 mm

0

NOT SPECIFIED

235

10 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B100

3

Not Qualified

e0

XCZU11EG-1FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1517

4

e1

XCZU11EG-2FFVC1760I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1760

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B1760

4

e1

VCBU68WMCE30

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

30

260

13 mm

CMOS

1.35 V

.65 mm

S-PBGA-B338

3

e1

XCZU4CG-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

900

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

245

CMOS

.85 V

R-PBGA-B900

4

e1

XCZU5EV-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

784

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

.876 V

GRID ARRAY

.825 V

100 Cel

-40 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

30

250

CMOS

.85 V

R-PBGA-B784

4

e1

CSR8670C-IBBH-R

Qualcomm

MICROPROCESSOR CIRCUIT

BALL

112

BGA

SQUARE

PLASTIC/EPOXY

YES

GRID ARRAY

BOTTOM

NOT SPECIFIED

NOT SPECIFIED

CMOS

S-PBGA-B112

DS8007-ENG

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

7 mm

CMOS

325 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e0

DS8007-ENG+

Analog Devices

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

1.6 mm

7 mm

30

260

7 mm

CMOS

325 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.