MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
DS28CM00R-A00+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL		1.45 mm			1.625 mm		IT ALSO OPERATE AT 1.8 V SUPPLY				30	260	2.9 mm		CMOS			5 V						.95 mm		R-PDSO-G5	1	Not Qualified		e3
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V								S-PBGA-B784	4			e1
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V							UNCASED CHIP		3 V	85 Cel		-40 Cel				UPPER											NOT SPECIFIED	NOT SPECIFIED			CMOS			3.3 V								S-XUUC-N188
STSPIN32F0A	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel				QUAD					7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS			8 V						.5 mm		S-XQCC-N48
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100					1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel		-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.6 mm			19 mm						30	260	19 mm		CMOS					Other uPs/uCs/Peripheral ICs				.8 mm		S-PBGA-B484	3	Not Qualified		e1
ESP32-WROOM-32UE	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED		3.35 mm			18 mm							250	19.2 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N38	3
FT800Q-T	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel				QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS			3.3 V						.5 mm		S-XQCC-N48
STSPIN32F0601TR	STMicroelectronics	MICROPROCESSOR CIRCUIT																																			NOT SPECIFIED	NOT SPECIFIED
CC-WMX-J97C-TN	Digi International	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES								GRID ARRAY			70 Cel		-20 Cel				BOTTOM					50 mm								50 mm		CMOS									2 mm		S-XBGA-N400
PGA460TPWR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS			12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
FT245RL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	SQUARE	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm						40	260	10.2 mm		CMOS									.65 mm		S-PDSO-G28	3
TMS320DM368ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
NRF52811-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel				QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.5 mm		S-XQCC-N32
RN2903A-I/RM103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD			UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N47				e4
FT245RL-TUBE	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm								10.2 mm		CMOS									.65 mm		R-PDSO-G28		Not Qualified
CC1310F128RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS			3.3 V						.5 mm		S-PQCC-N48	3			e4
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			5	IN-LINE	DIP14,.3	4.5 V	125 Cel		-40 Cel	MATTE TIN			DUAL		4.318 mm			7.62 mm								19.05 mm		CMOS			5 V		Parallel IO Port				2.54 mm		R-PDIP-T14		Not Qualified		e3
MSP430F67791AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit		3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90
MCP2221-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949					3.3/5	IN-LINE	DIP14,.3	3 V	85 Cel		-40 Cel	MATTE TIN			DUAL		5.334 mm			7.62 mm								19.05 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers				2.54 mm		R-PDIP-T14		Not Qualified		e3
CC1310F128RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			7 mm						30	260	7 mm	28672	CMOS			3.3 V						.5 mm		S-PQCC-N48	3			e4
MC-10105F1-821-FNA-M1-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V						1,3.3	GRID ARRAY	BGA196,14X14,40	.9 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.71 mm			15 mm		ALSO OPERATES AT 3.3 V						15 mm		CMOS			1 V		Other uPs/uCs/Peripheral ICs				1 mm		S-PBGA-B196		Not Qualified		e1
NRF52811-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel		-40 Cel				QUAD		.9 mm			6 mm								6 mm		CMOS			3 V						.4 mm		S-XQCC-N48
P82B715DG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V							SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm		BIPOLAR			5 V					I2C	1.27 mm		R-PDSO-G8	1	Not Qualified		e4
NRF52811-CAAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel		-40 Cel				BOTTOM		.535 mm			2.464 mm								2.482 mm		CMOS			3 V						.4 mm		R-PBGA-B33
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE		2.8 V	70 Cel		0 Cel	TIN LEAD			DUAL		1.5 mm			3.76 mm							245	3.94 mm		CMOS			3.3 V						1.27 mm		R-PDSO-C6	1	Not Qualified		e0
CC3200MODR1M2AMOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V				NO			CHIP CARRIER		2.3 V	70 Cel		-20 Cel	NICKEL GOLD	YES		BOTTOM	NO	2.45 mm			17.5 mm	0			0		30	260	20.5 mm		CMOS	4-Ch 12-Bit		3.3 V	NO				I2C; SPI; UART	1.27 mm		R-XBCC-B63	3			e4		25
STSPIN32F0ATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel				QUAD					7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS			8 V						.5 mm		S-XQCC-N48
DS2413P/T&R	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE		2.8 V	70 Cel		0 Cel	TIN LEAD			DUAL		1.5 mm			3.76 mm								3.94 mm		CMOS			3.3 V						1.27 mm		R-PDSO-C6	1	Not Qualified		e0
FT245RQ	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3.3 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm				8	12.02 MHz	40	260	5 mm		CMOS			5 V					USB	.5 mm		S-XQCC-N32	3
SAM9X60D1G-I/LZB	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	152	QMA	SQUARE	UNSPECIFIED	YES	5.5 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				QUAD		2.45 mm			28 mm								28 mm		CMOS			3.3 V						.65 mm		S-XQMA-N152
FT245BL-T/R	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V							FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN			QUAD		1.6 mm			7 mm						30	260	7 mm		CMOS			5 V						.8 mm		S-PQFP-G32	3			e3
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V							GRID ARRAY, HEAT SINK/SLUG		.97 V				TIN SILVER COPPER			BOTTOM		2.07 mm			19 mm						40	260	19 mm		CMOS			1 V						.8 mm		S-PBGA-B525	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY		32	50 MHz	30	260	16 mm		CMOS			1.3 V					I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS			1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCZU2CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM											30	250			CMOS			.85 V								R-PBGA-B484	4			e1
XCZU4EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V								R-PBGA-B784	4			e1
MCP25050-I/P	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			3/5	IN-LINE	DIP14,.3	2.7 V	85 Cel		-40 Cel	MATTE TIN			DUAL		4.318 mm			7.62 mm							260	19.05 mm		CMOS			5 V		Parallel IO Port				2.54 mm		R-PDIP-T14		Not Qualified		e3
NRF52811-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel				QUAD		.9 mm			5 mm								5 mm		CMOS			3 V						.5 mm		S-XQCC-N32
XCZU3CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V								S-PBGA-B784	4			e1
MCP25020-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel		-40 Cel	Matte Tin (Sn)			DUAL		1.75 mm			3.9 mm							260	8.65 mm		CMOS			5 V		Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified		e3
NRF52811-CAAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel		-40 Cel				BOTTOM		.535 mm			2.464 mm								2.482 mm		CMOS			3 V						.4 mm		R-PBGA-B33
XCZU11EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		3.51 mm			40 mm						30	245	40 mm		CMOS			.85 V						1 mm		R-PBGA-B1517	4			e1
XCZU4EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V							GRID ARRAY		.825 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V								R-PBGA-B784	4			e1
MCP2221-I/ML	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	TS 16949					3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN			QUAD		1 mm			4 mm								4 mm		CMOS		15 mA	3.3 V		Serial IO/Communication Controllers				.65 mm		S-PQCC-N16		Not Qualified		e3
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES								GRID ARRAY			100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250			CMOS			.85 V								S-PBGA-B784	4			e1
RN2903A-I/RM098	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD			UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm		CMOS			3.3 V						1.27 mm		R-XXMA-N47				e4
USB2660I-JZX-03	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V						3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel		-40 Cel	MATTE TIN			QUAD		1 mm			9 mm								9 mm		CMOS		275 mA	3.3 V		Bus Controllers				.5 mm		S-PQCC-N64		Not Qualified		e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.