MICROPROCESSOR CIRCUIT Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
LTC4263CS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE		4.5 V	70 Cel			0 Cel	MATTE TIN		DUAL		1.752 mm			3.899 mm							30	260	8.649 mm			CMOS			5 V								1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MCP25050T-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949		8			3/5	SMALL OUTLINE	SOP14,.24	2.7 V	85 Cel			-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm									8.65 mm			CMOS			5 V				Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MKW41Z512VHT4R	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V								CHIP CARRIER		1.71 V	105 Cel			-40 Cel	NICKEL GOLD		QUAD												40	260				CMOS			3.3 V										S-XQCC-N48	3				e4
MSP430F67791AIPEU	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm		e4	8	90
MSP430F67791AIPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm		e4	8	62
XCZU2EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B625	4				e1
XAZU2EG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY		YES									GRID ARRAY, FINE PITCH			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.43 mm			21 mm							30	250	21 mm			CMOS			.72 V								.8 mm		S-PBGA-B625	3				e1
NT3H2111W0FT1X	NXP Semiconductors	MICROPROCESSOR CIRCUIT																								NICKEL PALLADIUM GOLD SILVER														30	260																		1				e4
CC3220MODASM2MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					NO			CHIP CARRIER		2.3 V	85 Cel			-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0			TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit		3.3 V		NO			I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm		R-XBCC-B63	3				e4	8	25
MSP430F67791IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0		30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
MSP430F6779AIPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	14 mm		32768	CMOS	6-Ch 10-Bit		3.3 V		YES			I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3		25 rpm		e4	8	62
FCM8531QY	Onsemi	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V								FLATPACK, LOW PROFILE	QFP32,.35SQ,32	4.5 V	85 Cel			-40 Cel			QUAD		1.6 mm			7 mm							NOT SPECIFIED	NOT SPECIFIED	7 mm			CMOS			5 V							I2C; SPI; UART	.8 mm		S-PQFP-G32
LTC4263IDE#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	85 Cel			-40 Cel	MATTE TIN		DUAL		.8 mm			3 mm							30	260	4 mm			CMOS			5 V								.5 mm		R-PDSO-N14	1	Not Qualified			e3
RF430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES									CHIP CARRIER, VERY THIN PROFILE			70 Cel			0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm			4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE			0		30	260	4 mm			CMOS										I2C; SPI	.5 mm		S-PQCC-N24	2				e4
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
CC2540F256RHAR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V							3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm		8	6 mm				COMPARATORS, TIMER(4)			30	260	6 mm		8192	CMOS			3 V				Other uPs/uCs/Peripheral ICs			SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified			e4		21
CC3220MODSM2MOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	NO	YES	3.6 V	8		0		NO			CHIP CARRIER		2.3 V	85 Cel	CORTEX-M4	0	-40 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	1024000	256	17.5 mm	0		YES	TIMER(4), WDT	0		30	260	20.5 mm	4	262144	CMOS	4-Ch 12-Bit		3.3 V	2	NO	2		I2C, I2S, SD, SPI, UART	FLASH		1.27 mm	FIXED POINT	R-XBCC-B63	3		2400 rpm	YES	e4	8	25
MSP430F6779IPZ	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0	25 MHz	30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
NT3H2111W0FHK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	UNSPECIFIED		YES	3.6 V								CHIP CARRIER		1.67 V	105 Cel			-40 Cel			QUAD		.5 mm			1.6 mm									1.6 mm			CMOS			1.8 V										S-XQCC-N8
XCZU2CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B625	4				e1
UCD3138ARJAT	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	125 Cel			-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	YES	QUAD		1 mm			6 mm							30	260	6 mm			CMOS			3.3 V								.5 mm		S-PQCC-N40	2				e4
VS3674PITTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
VS3674UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel			0 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm							30	260	13 mm			CMOS			1.35 V								.65 mm		S-PBGA-B338	3				e1
XCZU3CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	250				CMOS			.85 V										R-PBGA-B625	4				e1
P82B715PE4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	12 V								IN-LINE		4.5 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		DUAL		5.08 mm			7.62 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12			0	.4 MHz	NOT SPECIFIED	260	9.81 mm			BIPOLAR			5 V							I2C	2.54 mm		R-PDIP-T8	1	Not Qualified			e4
LS1021ASN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V								GRID ARRAY, HEAT SINK/SLUG		.97 V					TIN SILVER COPPER		BOTTOM		2.07 mm			19 mm							40	260	19 mm			CMOS			1 V								.8 mm		S-PBGA-B525	3				e1
MCP25050-E/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V		TS 16949		8			5	SMALL OUTLINE	SOP14,.24	4.5 V	125 Cel			-40 Cel	Matte Tin (Sn)		DUAL		1.75 mm			3.9 mm									8.65 mm			CMOS			5 V				Parallel IO Port				1.27 mm		R-PDSO-G14	1	Not Qualified			e3
MTFC4GLDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V								GRID ARRAY, LOW PROFILE		2.7 V	85 Cel			-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		1.4 mm			14 mm							30	260	18 mm			CMOS			3.3 V								1 mm		R-PBGA-B100					e1
XCZU5CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY		YES									GRID ARRAY			100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	250				CMOS			.85 V										S-PBGA-B784	4				e1
BM94801KUT-Z	ROHM	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY		YES	1.65 V								FLATPACK, THIN PROFILE, FINE PITCH		1.5 V	85 Cel			-40 Cel			QUAD		1.2 mm			14 mm							NOT SPECIFIED	NOT SPECIFIED	14 mm			CMOS			1.55 V								.4 mm		S-PQFP-G128
CC1310F32RGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.8 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1 mm			7 mm							NOT SPECIFIED	260	7 mm		28672	CMOS			3.3 V								.5 mm		S-PQCC-N48	3				e4
CP2108-B02-GM	Silicon Labs	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3 V	85 Cel			-40 Cel			QUAD		.9 mm			9 mm							NOT SPECIFIED	NOT SPECIFIED	9 mm			CMOS			3.3 V								.5 mm		S-XQCC-N64
MSP430F6779IPZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.8 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD	YES	QUAD		1.6 mm	524288	32	14 mm					0	25 MHz	30	260	14 mm		32768	CMOS		11.75 mA	3.3 V				Microcontrollers		FLASH	I2C; SPI; UART	.5 mm		S-PQFP-G100	3	Not Qualified	25 rpm		e4
SCANSTA112VS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V							3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	3 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1.2 mm			14 mm					0		NOT SPECIFIED	260	14 mm			CMOS			3.3 V				Other Microprocessor ICs				.5 mm		S-PQFP-G100	3	Not Qualified			e4
XCZU5EV-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.876 V								GRID ARRAY		.825 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM												30	245				CMOS			.85 V										R-PBGA-B900	4				e1
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V					NO			CHIP CARRIER		2.3 V	70 Cel			-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm			17.5 mm	0				0		30	260	20.5 mm			CMOS	4-Ch 12-Bit		3.3 V		NO					I2C; SPI; UART	1.27 mm		R-XBCC-B63	3				e4		25
CSR8675C-IBBH-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY		YES									GRID ARRAY									BOTTOM																	CMOS													X-PBGA-B
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.95 V								GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		.8 mm			11.5 mm		IT ALSO OPERATES AT 3.3 VOLTS							13 mm			CMOS			1.8 V								.5 mm		R-PBGA-B153					e1
XCZU4EV-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.742 V								GRID ARRAY		.698 V	100 Cel			-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM							ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					30	245				CMOS			.72 V										R-PBGA-B900	4				e1
CC430F5147IRGZR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V						16	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	2.4 V	85 Cel	MSP430		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	32768	4	7 mm		IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY		TIMER		20 MHz	30	260	7 mm		4096	CMOS			3.3 V				Microcontrollers		FLASH	I2C; SPI; UART; USB	.5 mm		S-PQCC-N48	3	Not Qualified	20 rpm		e4		30
CY8C4248LQI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel			-40 Cel			QUAD		.6 mm			7 mm									7 mm			CMOS			3.3 V								.4 mm		S-XQCC-N56
SCANSTA111MTX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.6 V							3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP48,.3,20	3 V	85 Cel			-40 Cel	MATTE TIN		DUAL		1.2 mm			6.1 mm							30	260	12.5 mm			CMOS			3.3 V				Other Microprocessor ICs				.5 mm		R-PDSO-G48	2	Not Qualified			e3
XCZU7EV-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY		YES	.927 V								GRID ARRAY		.873 V	100 Cel			0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM												30	245				CMOS			.9 V										R-PBGA-B1156	4				e1
XCZU7EV-3FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY		YES									GRID ARRAY			100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm			35 mm									35 mm			CMOS			.9 V								1 mm		S-PBGA-B1156	4				e1
MTFC4GMDEA-4MIT/TR	Micron Technology	MICROPROCESSOR CIRCUIT																								TIN SILVER COPPER
TMS320DM365ZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.42 V						32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		8192	13 mm					32		30	260	13 mm			CMOS			1.35 V				Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified			e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			32	50 MHz	30	260	13 mm			CMOS			1.3 V							I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm		e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.35 V								GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			16 mm		IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			32	50 MHz	30	260	16 mm			CMOS			1.3 V							I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.