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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XAZU7EV-1FBVB900Q |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XAZU7EV-1FBVB900Q Datasheet |
| In Stock | 307 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .85 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.97 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 900 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B900 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | BGA |
| Width: | 31 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| External Data Bus Width: | 0 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA900,30X30,40 |
| Length: | 31 mm |
| Peak Reflow Temperature (C): | 245 |
| Bus Compatibility: | CAN, I2C, SPI, UART |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | AUTOMOTIVE |
