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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TCI6630K2LDCMSA2 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .95 V; |
Datasheet | TCI6630K2LDCMSA2 Datasheet |
In Stock | 1,004 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .902 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .95 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Supply Voltage: | .997 V |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 900 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 245 |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 4 |