Texas Instruments - TMS320DM365ZCEF

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TMS320DM365ZCEF by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TMS320DM365ZCEF
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet TMS320DM365ZCEF Datasheet
In Stock213
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.3 mm
Sub-Category: Digital Signal Processors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 338
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
RAM Words: 8192
JESD-30 Code: S-PBGA-B338
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Other Names: TMS320DM365ZCEF-ND
-DM365ZCEZ
-TMS320DM365ZCEZ
-TMS320DM365ZCEZ-NDR
2156-TMS320DM365ZCEF
296-43134
TEXTISTMS320DM365ZCEF
-DM365ZCEZ-NDR
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.26 V
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA338,19X19,25
Length: 13 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: I2C; SPI; UART; USB
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.2,1.8,3.3
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