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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC7Z010-1CLG225C |
| Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel; |
| Datasheet | XC7Z010-1CLG225C Datasheet |
| In Stock | 121 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .95 V |
| Other Names: | 122-1855 |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Nominal Supply Voltage: | 1 V |
| Maximum Supply Voltage: | 1.05 V |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 225 |
| Package Equivalence Code: | BGA225,15X15,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 13 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B225 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 13 mm |
| Terminal Pitch: | .8 mm |









